In the production and manufacturing of PCB, the "Bosch process" is a deep silicon etching technology, particularly suitable for applications such as Through-Silicon Vias (TSV) and Micro-Electro-Mechanical Systems (MEMS), which require the etching of deep holes or slots in silicon wafers. The Bosch process ensures the steepness of the sidewalls by alternating etching and passivation gases, achieving high aspect ratio structure etching.
First, let’s learn about the name and background of Bosch technique.
2024-12-05