In general, the solder mask thickness in the middle position of the line is generally not less than 10 microns, and the position on both sides of the line is generally not less than 5 microns, which used to be stipulated in the IPC standard, but now it is not required, and the specific requirements of the customer shall prevail.
The solder resistance film must have good film formation to ensure that it can be uniformly covered on the PCB wire and pad to form effective protection.
PCB solder mask can be displayed in different colors, including green, white, blue, black, red, yellow, matte, purple, chrysanthemum, bright green, matte black, matte green and so on.
Immersion gold uses the method of chemical deposition, through the chemical redox reaction method to generate a layer of plating, generally thicker, is a chemical nickel gold gold layer deposition method, can achieve a thicker layer of gold.
Now we will be in the heat dissipation, soldering strength, the ability to carry out electronic testing and the difficulty of the manufacture corresponding to the cost of four aspects of the immersion gold manufacture compared with other surface treatment manufacturees.
