The PCB industry is developing rapidly and constantly adapting to the needs of downstream electronic terminal equipment. Advanced technologies such as high-density interconnect (HDI) technology, multi-layer board technology, and special material processing capabilities are widely used. Sanxis company have high-precision processing capabilities and can handle complex designs and difficult products to ensure stable product quality and performance.
With our superior testing, simulation and miniaturization capabilities and design excellence services, we can help you identify key design improvements to optimize manufacturing before you start production.
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Our manufacturing technique includes flip chips to small passive and shaped components, high density assembly, low gap welding, proper bottom fill, edge sealing (including PCB protection with nanocoatings and conformal coatings), and a deep understanding of the impact of materials on signal integrity. Through our professional services, you can apply new PCB manufacturing technology to create the best performance and most stable PCB products in your mind.
If you would like to know more about our technology and manufacture capacity, please see the details in the left subcategory.
