In the production and manufacturing of PCB copper foil, "electrodeposited copper foil" and "rolled copper foil" are two main copper foil production processes, each with its own characteristics and applications. In addition, you could see the two production processes more clearly in the schematic of the cover.
Today Let's Learn about the different standard in copper foil industrial.
Normally, there are four basic standards in copper manufacturing, American IPC, European IEC, Japanese JIS, and China National & Chinese Military Standards.
In PCB routing design, ensuring minimal loop area is an important consideration. Loop area refers to the area enclosed by the signal trace and its return path. The size of this loop area directly affects the electromagnetic compatibility (EMC) and radio frequency interference (RFI) of the circuit.
Today, Let’s learn about the notes about setting electronic components on PCB routing:
In the PCB design process, starting from the schematic is a crucial step that determines the basic functionality and performance of the circuit.
As we all know that, perfect quality check makes perfect product.
The cover figure is showing that our quality checking engineer is checking the new product which just finished, after the checking we will keep some samples for finding other possible improvements for our customers.
