The four-layer server power gold finger module board is a high-performance PCB (printed circuit board) designed for server power management.
Power Goldfinger Module Board For ServerProduct Introduction
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1.Product Overview
The four-layer server power gold finger module board is a high-performance PCB (printed circuit board) designed for server power management. The module board adopts a gold finger interface to ensure the stability and reliability of the power connection, and is widely used in data centers, cloud computing, and high-performance computing.
2.Main Features
Four-layer design:
Adopting a four-layer PCB structure, it optimizes power distribution and signal integrity.
Effectively reduces electromagnetic interference (EMI) and improves the stability of power management.
Gold finger interface:
The gold finger part uses highly conductive materials to ensure good electrical contact.
The design complies with industry standards and is suitable for power connections that are frequently plugged and unplugged.
High power carrying capacity:
The design can carry high power loads and is suitable for the needs of high-performance servers.
High-temperature materials are used to ensure safe operation under high load conditions.
Modular design:
Supports modular design, which is easy to integrate with other power management modules.
Facilitates rapid replacement and maintenance, improving system availability.
Multiple surface treatments:
Provide multiple surface treatment options, such as ENIG, HASL, etc. to meet different customer needs.
Adapt to different welding processes and environmental requirements.
3.Technical Specifications
| Number of layers | 4 layers | Ink color | green oil white text |
| Material | FR-4, S1000 | Minimum line width/line spacing | 0.1mm/0.1mm |
| Thickness | 1.6mm | Gold finger thickness | 30 wheat |
| Copper thickness | inner 0.5 outer layer 1OZ | Surface treatment | immersion gold |
4.Application Areas
Server power supply: used for various types of server power modules.
Data center: supports high-density power management solutions.
Cloud computing: suitable for cloud servers and virtualization environments.
High-performance computing: meets the power needs of high-performance computing clusters.
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5.Conclusion
The four-layer server power gold finger module board is a high-performance and reliable product designed to meet the power management needs of modern servers. Its gold finger interface and modular design make it an ideal choice for efficient power solutions, providing stable power support for data centers and high-performance computing.
FAQ
Q: How many staffs do you have in your factory?
A: 500 + people.
Q: Are the materials used environmentally friendly?
A: The materials used comply with ROHS standards and IPC-4101 standards.
Q: Will the gold finger PCB be contaminated on the surface?
A: The surface of the gold finger may be contaminated with dirt, which will affect its normal function and use. The solution to this problem includes cleaning with appropriate cleaning agents, such as IPA solution, anhydrous ethanol, etc. These cleaning methods can effectively remove dirt on the surface of the gold finger and restore its normal function.
Q: Will the gold finger PCB change color?
A: The gold finger may change color, which may be caused by raw material problems, human factors, or SMT process factors in the production process. The solution to this problem includes cleaning with appropriate cleaning agents, such as anhydrous ethanol, or using more expensive gold plating liquid for treatment. However, it should be noted that although the gold plating liquid has good effects, it is expensive and may contain toxicity.
Q: Is the gold finger PCB solder paste printed poorly?
A: In the SMT process, if the solder paste is poorly printed and repeated printing is performed without cleaning, it may cause printing quality problems. The solution to this problem includes ensuring cleaning during the printing process to avoid quality problems caused by repeated printing.
Q: Gold finger PCB flux corrosion?
A: The flux of wave soldering may corrode the gold finger, resulting in solder marks on the gold finger. This situation is usually caused by the use of no-clean flux, which has strong penetration ability and may cause the gold finger to be corroded. The solution to this problem includes improving the welding process, using a more suitable gold finger protection flux, or performing appropriate post-processing after welding to reduce the corrosion of the flux on the gold finger.
Q: Will there be lead residues after gold finger PCB etching?
A: We can remove lead residues for thick gold fingers.
