As a PCB production and sales company, we possess industry-leading production technologies. We can customize various PCB products of different types, models, and materials for customers. Our production and manufacturing technologies include laser drilling, immersion gold plating process, gold finger manufacturing process, HDI manufacturing process, etc., providing diverse choices for customers and meeting their different needs. Whether it's through hole PCB or HDI PCB, we can meet production requirements.
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| Electroplating etching production line | LDI developing machine |
And here are some process capability tables following：
| Through hole plate production capacity table |
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| Item | Remark | Unit | Mass production | Advance capability |
| Material type | FR-4/Microwave laminate/ceramics | / |
Normal FR4:KB-6160; S1141; IT-140; (H140A) Mid Tg: KB-6165F; S1000; IT-158; (H150LF) High Tg: S1000-2; IT-180A; HF FR-4: S1150G;(H1170) |
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| PCB size | Max | mm | 420x540 | / |
| Min | mm | 10x15 | / | |
| # of layer | Max | L | 12 | 22 |
| Finished board thickness | Max | mm |
"3.200 (ENIG); 2.400 (Other finishing);" |
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| Min | mm | 0.400 | / | |
| HDI process capability table | |||||||||
| Material type and supplie | TgOrdinary Tg material | Material name | "Corresponding supplier" | "High speed material" | Material name | Corresponding supplier | |||
| 1 | IT140 | ITEQ Corporation | 1 | MEG4 R-5725 R-5620 | Panasonic Electronics | ||||
| 2 | S1141 | Shengyi Electronics CO.,LTD | 2 | MEG4S R-5725S R-5620S | Panasonic Electronics | ||||
| 3 | GW4011 | Goworld Co.,Ltd. | 3 | MEG6 R-5775 R-5670 | Panasonic Electronics | ||||
| 4 | NY2140 | Shanghai Nanya Copper Clad Laminate | MEG7 R-5785 R-5680 | Panasonic Electronics | |||||
| TgMedium Tg materials | TgMedium Tg halogen-free material | Material Name | Corresponding supplier | MEG7N R-5785N R-5680N | Panasonic Electronics | ||||
| 1 | IT158 | ITEQ Corporation | 1 | IT150GM | ITEQ Corporation | ||||
| 2 | S1000H | Shengyi Electronics CO.,LTD | 2 | S1150G | Shengyi Electronics CO.,LTD | ||||
| 3 | EM-825 | EMC | 3 | EM-370(5) | EMC | ||||
| 4 | GW1500 | Goworld Co.,Ltd. | 4 | EM-285 | EMC | ||||
| 5 | NP155-F | NAN YA PLASTICS CORP | 5 | TU-747 | Taiwan Union Technology Corporation | ||||
| TgHigh Tg materials | TgMedium Tg halogen-free material | Material Name | Corresponding supplier | ||||||
| 1 | IT180 | ITEQ Corporation | 1 | TU-862HF | Taiwan Union Technology Corporation | ||||
| 2 | S1000-2 | Shengyi Electronics CO.,LTD | 2 | IT170FR1 | ITEQ Corporation | ||||
| 3 | EM-827 | EMC | |||||||
| 4 | GW1700 | Goworld Co.,Ltd. | |||||||
| Special process capacity table | |||||||||||
| Special process classification | Have the ability | Ability statistics | |||||||||
| POFV Resin jack and POFV | Y | Jack capacity | Maximum plate thickness | Minimum plate thickness | Maximum hole | ratio of thickness to radial dimension | Distance between jack and non-jack | Whether to send out jack holes | Maximum resin depression | ||
| Semi-automatic jack | 1.8mm | 0.3mm | 0.55mm(） | 5:1 | ≥0.35mm | 70% | |||||
| Vacuum wire mesh jack | 12mm | 0.1mm | 1.0mm | 30:1 | ≥0.5mm | POFAPOFA part number needs to be sent out | ≤25μm | aperture＜0.8mm，sunken≤25μm； | |||
| Vacuum aluminum sheet jack 12mm | 12mm | 0.1mm | ∕ | 30:1 | ≥0.2mm | POFAPOFA part number needs to be sent out | ≤25μm | aperture≥0.8mm，sunken≤75μm. | |||
| /Flatten/brush the board | Maximum plate thickness | Minimum plate thickness | critical control point | Whether to send it out | |||||||
| Brush and grind | 3.5 | 0.4 | Grinding current | no |
<0.4mmoutsource |
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| throwing power | Max. cutting thickness | The lowest depth | critical control point | Maximum bulge | Maximum depression | ||||||
| electroplate | 3.5mm | 0.4mm | Copper coating thickness | 25um | |||||||
| Basic processing flow | |||||||||||
If you want to check more process capability tables, please click this link to download the list of all equipment.
