The 10-Layer High-Frequency & High-Speed Communication PCB is engineered to address the rigorous demands of modern high-frequency communication systems, including 5G networks, satellite communications, and advanced radar technologies. Utilizing EM-892K substrate with ultra-low dielectric loss (Dk=3.8@10GHz, Df=0.002), this PCB ensures minimal signal distortion even in multi-GHz frequency ranges.
The 10-Layer HDI (High-Density Interconnect) High-Frequency & High-Speed Optical Module Test PCB is a cutting-edge solution designed for precision testing of optical communication modules. Tailored for R&D validation, production line testing, and quality assurance, this PCB ensures ultra-low signal loss and exceptional signal integrity in high-speed data transmission scenarios (25Gbps to 56Gbps PAM4).
The 8-Layer High-End Mechanical Arm System Dedicated Rigid-Flex PCB is an advanced printed circuit board engineered for high-precision control in industrial automation. Designed for modern factory production lines, this PCB integrates rigid and flexible sections using FCCL (Flexible Copper Clad Laminate) and FR-4 substrates, ensuring seamless signal transmission and robust mechanical performance.
Designed exclusively for premium smartwatches, this 8-layer rigid-flex PCB combines FR4 rigid boards with FPC (Flexible Printed Circuit) technology, delivering high-density routing, bend resistance, lightweight construction, and ultra-thin profiles.
The 6-layer soft-hard combined PCB for electronic scanners is a high-performance circuit board specifically designed for handheld scanning devices. This product combines the advantages of rigid boards (FR-4) and flexible circuit boards (FCCL), enabling high-density wiring and complex electronic functions within a limited space while ensuring the product's lightweight and flexible nature.
The 6-layer soft-hard combined PCB for electronic educational toys is a high-performance circuit board specifically designed for children's educational electronic toys and other consumer electronic products. This product combines the advantages of rigid boards (FR-4) and flexible boards (FPC), enabling complex electronic functions within a limited space while ensuring the product's lightweight and flexible nature.
The 8-layer high-temperature-resistant industrial control gold finger PCB is a high-performance printed circuit board specifically designed for the electronic control systems of high-power industrial machinery. It employs advanced materials and manufacturing processes to maintain stable electrical performance and signal transmission capabilities in high-temperature environments, ensuring the reliable operation of industrial equipment.
The "6-layer 5G Communication System AC PCB" is a high-performance printed circuit board specifically designed for 5G communication systems. It meets the stringent requirements of 5G communication equipment for high-speed signal transmission, high-density wiring, and high reliability.
The "12-layer Second-Generation Communication Receiver System Dedicated AC PCB" is a high-performance printed circuit board specifically designed for the second-generation signal receiving terminals in communication systems.
The “14-layer Communication Receiving AC PCB” is a high-performance printed circuit board specifically designed for the terminal of signal receiving in communication systems.
The "4-layer Miniature IC Chip Mounting PCB" is a high-performance printed circuit board specifically designed for the assembly of high-consumption miniature IC chips. It utilizes advanced manufacturing processes and high-quality materials to ensure stable and reliable electrical connections and signal transmission in high-density, high-precision electronic devices.
The 8-layer HDI PCB for 800G optical communication modules is a high-performance printed circuit board designed specifically for high-speed transmission of optical communication signals. It features an advanced 8-layer HDI structure, combined with high-performance Pana M6 substrate and 2u gold plating surface treatment, ensuring excellent electrical performance and reliability.