The 6-layer soft-hard combined PCB for electronic scanners is a high-performance circuit board specifically designed for handheld scanning devices. This product combines the advantages of rigid boards (FR-4) and flexible circuit boards (FCCL), enabling high-density wiring and complex electronic functions within a limited space while ensuring the product's lightweight and flexible nature.
The 6-layer soft-hard combined PCB for electronic educational toys is a high-performance circuit board specifically designed for children's educational electronic toys and other consumer electronic products. This product combines the advantages of rigid boards (FR-4) and flexible boards (FPC), enabling complex electronic functions within a limited space while ensuring the product's lightweight and flexible nature.
The 8-layer high-temperature-resistant industrial control gold finger PCB is a high-performance printed circuit board specifically designed for the electronic control systems of high-power industrial machinery. It employs advanced materials and manufacturing processes to maintain stable electrical performance and signal transmission capabilities in high-temperature environments, ensuring the reliable operation of industrial equipment.
The "6-layer 5G Communication System AC PCB" is a high-performance printed circuit board specifically designed for 5G communication systems. It meets the stringent requirements of 5G communication equipment for high-speed signal transmission, high-density wiring, and high reliability.
The "12-layer Second-Generation Communication Receiver System Dedicated AC PCB" is a high-performance printed circuit board specifically designed for the second-generation signal receiving terminals in communication systems.
The “14-layer Communication Receiving AC PCB” is a high-performance printed circuit board specifically designed for the terminal of signal receiving in communication systems.
The "4-layer Miniature IC Chip Mounting PCB" is a high-performance printed circuit board specifically designed for the assembly of high-consumption miniature IC chips. It utilizes advanced manufacturing processes and high-quality materials to ensure stable and reliable electrical connections and signal transmission in high-density, high-precision electronic devices.
The 8-layer HDI PCB for 800G optical communication modules is a high-performance printed circuit board designed specifically for high-speed transmission of optical communication signals. It features an advanced 8-layer HDI structure, combined with high-performance Pana M6 substrate and 2u gold plating surface treatment, ensuring excellent electrical performance and reliability.
The 4-layer PCB for small optical communication instruments is a high-performance printed circuit board designed specifically for small optical communication signal transmission systems. It features a 4-layer structure with advanced FR-4 substrate and gold plating surface treatment, ensuring excellent electrical performance and reliability.
The 16-layer HDI Camera Video Signal Processing PCB is specifically designed for processing video signals in small cameras. This product utilizes high-performance EM-390 substrate and a thickness of 2.0mm, ensuring the mechanical strength and stability of the PCB.
The 3-layer Dual Switch Rigid-Flex PCB is specifically designed for switch applications in small communication devices. This product combines the advantages of rigid and flexible boards, enabling complex circuit layouts and flexible wiring within limited space.
