Today Let's Learn about the different standard in copper foil industrial.
Normally, there are four basic standards in copper manufacturing, American IPC, European IEC, Japanese JIS, and China National & Chinese Military Standards.
1. Institute of Printed Circuits (IPC) Standards:
These standards include IPC-CF-150 (1966), IPC-MF-150G (1999), IPC-4562A (2008, currently in use), and IPC-4101D. These standards detail the classification, technical requirements, test methods, and inspection rules for copper foil, serving as important reference standards for the manufacturing of PCB copper foil.
2. International Electrotechnical Commission (IEC) Standards:
IEC-249-3A (1976) is a standard issued by the International Electrotechnical Commission regarding the base materials for printed circuits, covering the technical requirements for special materials used in printed circuits, including copper foil.
3. Japanese Industrial Standards (JIS):
JIS-C-6511 (1992), JIS-C-6512 (1992), and JIS-C-6513 (1996) are Japanese industrial standards that specify the technical conditions and testing methods for copper foil, commonly used in copper foil manufacturing in Asia, especially Japan.
4. Chinese National Standards and Military Standards:
GB/T5230-2020, GB/T29847-2013, and GJB 2142A-2011 are Chinese national and military standards that regulate the requirements for electrolytic copper foil used in printed boards, including classification, technical requirements, and test methods, serving as the basis for copper foil manufacturing and use in China.
