Today, let’s continue to learn about the last two kinds of copper foil: HTE copper foil and RTF copper foil:
1. RCC copper foil:
Resin Coated Copper Foil is a type of copper foil with a thin electro-deposited copper foil (generally not exceeding 18μm in thickness) that has one or two layers of specially formulated resin adhesive applied to its roughened surface. The resin is typically composed mainly of epoxy resin. After processing and drying in an oven to remove the solvent, the resin becomes a semi-cured B-stage form. The thickness of RCC is usually 12μm, and the resin layer thickness is between 40-100μm. In the process of making multi-layer boards using the build-up method, RCC can replace the traditional combination of semi-cured sheets and copper foils.
2. UTF copper foil:
Ultra Thin Copper Foil refers to copper foil with a thickness of less than 12μm. Common ultra-thin copper foils are below 9μm in thickness and are mainly used in the manufacture of fine-line printed circuit boards. Due to the difficulty in handling ultra-thin copper foils, they are generally supported by carriers, which can include copper foil, aluminum foil, and organic films.
All above is what we learned about copper foil in PCB manufacturing, if you have more want to talk or learn, or you want to take an order with us, pls contact with us.
