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The Copper Foil on PCB (Part 6)

2024-11-28

The Finished Copper Foil

Let's continue to learn about other categories of copper foil:

1. Very Low Profile Copper Foil (VLP Copper Foil): With an extremely low profile, suitable for fine lines and high-frequency high-speed applications.

2. Electrolytic Copper Foil: Produced through an electrolytic process where copper layers are deposited on the cathode, the most mainstream production method.

3. Rolled Copper Foil: Produced through physical rolling, offering better ductility and consistency.

4. High-Temperature High-Elongation Copper Foil (HTE): Surface roughness Rz is about 7-8μm, suitable for applications that maintain good ductility in high-temperature environments.

5. Reverse Treated Copper Foil (RTF): Roughness is about 4-6μm, improving the adhesion of copper foil to insulating materials.

6. Low Profile Copper Foil: Roughness is about 3-4μm, suitable for high-speed signal transmission.

7. Ultra-Low Profile Copper Foil: Roughness is about 1-2μm, providing a smoother surface to reduce signal attenuation.

 

Normally, according to IPC4562A Standards, these copper foil will be divided to these three kinds below:

1. E - Electrolytic Foil: Copper foil produced through electrolytic processes.

2. W - Rolled Foil: Copper foil produced through rolling processes.

3. O - Other Foils: Copper foils produced by other processes besides electrolytic and rolling.