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The next two types of lamination structures to be presented are the "N+N" structure and the any-layer interconnect structure.

Let's continue to introduce the next structure: “2-N-2” structure.

Today, let's start with the simplest stack-up design, the "1-N-1" structure.

We all know that in the modern electronics manufacturing field, HDI technology has become a key factor in driving electronic products towards miniaturization and higher performance. The core of HDI technology lies in its unique stack-up design, which not only greatly enhances the space utilization of the circuit board but also significantly strengthens electrical performance and signal integrity.

Next, we continue to study the electroplating capabilities of high aspect ratio HDI boards.

As we all know that, With the rapid development of communication and electronic products, the design of printed circuit boards as carrier substrates is also moving towards higher levels and higher density. High multi-layer backplanes or motherboards with more layers, thicker board thickness, smaller hole diameters, and denser wiring will have greater demand in the context of the continuous development of information technology, which will inevitably bring greater challenges to the PCB-related processing processes.

Mobile PCB are one of the most critical components inside a mobile phone, responsible for power and signal transmission as well as the connection and communication between different modules.

Today, let's explore how to test SMT stencils. The quality inspection of SMT stencil templates is mainly divided into the following four steps

Today we will continue to learn about the last method of manufacturing PCB SMT stencils: Hybrid process.

Today we will continue to learn about the third method of manufacturing PCB SMT stencils: Electroforming.

Today we will continue to learn about the second method of manufacturing PCB SMT stencils: Laser Cutting. Laser cutting is currently the most popular method for manufacturing SMT stencils. In the SMT pick-and-place processing industry, more than 95% of manufacturers, including us, use laser cutting for stencil production.

Today, we will continue to explore the three methods of manufacturing PCB SMT stencils: Chemical Etching (Chemical Etching Stencil), Laser Cutting (Laser Cutting Stencil), and Electroforming (Electroformed Stencil). Let's start form chemical etching.