NEWS

 In the previous news article, we introduced what flip chip is. So, what is the process flow of flip chip technology? In this news article, let's study in detail the specific process flow of flip chip technology.

Last time we mentioned the “flip chip” in the chip packaging technology table, then what is the flip chip technology? So let's learn that in today’s new.

Here are the table of Chip packaging corresponding substrate types

As shown in the figure above, packaging substrates are divided into three major categories: organic substrates, lead frame substrates, and ceramic substrates.

Today, I will tell you what is the meaning of TG, and what are the advantages of using high TG PCB.

Today Let’s talk about the five parameter units of PCB and what are the meaning of them. 1.Dielectric Constant (DK value) 2.TG (Glass Transition Temperature) 3.CTI (Comparative Tracking Index) 4.TD (Thermal Decomposition Temperature) 5.CTE (Z-axis)—(Coefficient of Thermal Expansion in the Z-direction)

Let’s continue to learn about the last two types of holes found on HDI PCB. 1.Plated Through Hole 2.No-Plated Through Hole

Let’s continue to learn about the various types of holes found on HDI PCB. 1.Guard Holes 2.Back Drill Hole

Let’s continue to learn about the various types of holes found on HDI PCB. 1.Tangency hole 2.Superimposed hole

Let’s continue to learn about the various types of holes found on HDI PCB. 1.Two-step hole 2.Any-layer hole.

Let’s continue to learn about the various types of holes found on HDI PCB.1.Slot hole 2.Blind-buried hole 3.One-step hole.

Let’s continue to learn about the various types of holes found on HDI PCB. 1.Blind Via 2.Buried Via 3.Sunk hole.