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Let's continue to learn about the main difficulties of IC substrates manufacturing process: 1. Solder mask 2. Surface treatment 3. Inspection capabilities and product reliability testing techniques

The manufacturing process of IC substrates is highly complex, leading to numerous challenges. Here are some of the main difficulties

Today, we delve into the unique manufacturing processes of IC substrates, which ensure their high performance and reliability:

Happy New Year’s Day. Sanxis Tech wishes you have a good day. Today, we delve into the three core manufacturing technologies of IC substrates, which are crucial for achieving high-performance electronic devices:

What is IC Carrier PCB (Part 6)

IC substrates play a crucial role in various high-tech fields due to their importance in mounting high-precision chips. Here are some of the main application areas for IC substrates, each reflecting the unique value of IC substrates:

Today, we will delve into the material property classification of IC substrates. Due to the diverse functionalities of integrated circuits, their substrates require different material types and characteristics to meet specific performance demands.

Today, we will explore the different bonding technologies used to classify IC substrates. Bonding technology refers to the way integrated circuits are connected to packaging or external circuits, with each connection method requiring the substrate to have specific characteristics.

Now, let’s talk about the different types of IC substrates. IC substrates come in a variety of types, divided into three major categories: packaging/type, bonding technology, and material properties/characteristics. Additionally, they can be categorized into different application fields.

From 2022 to 2024, the global shortage of integrated circuit production has highlighted the importance of integrated circuits. A key feature of contemporary integrated circuits is their packaging. Similar to connection-type PCB, they require specialized substrates.

In the production and manufacturing of PCB, the production principles of thick copper PCB mainly revolve around their needs to carry high current, high power, and high reliability.

Thick copper PCB play a significant role in various fields due to their excellent electrical performance and mechanical strength. Here are some of the main application areas of thick copper PCB and their explanations