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Today, we will explore the different bonding technologies used to classify IC substrates. Bonding technology refers to the way integrated circuits are connected to packaging or external circuits, with each connection method requiring the substrate to have specific characteristics.

Now, let’s talk about the different types of IC substrates. IC substrates come in a variety of types, divided into three major categories: packaging/type, bonding technology, and material properties/characteristics. Additionally, they can be categorized into different application fields.

From 2022 to 2024, the global shortage of integrated circuit production has highlighted the importance of integrated circuits. A key feature of contemporary integrated circuits is their packaging. Similar to connection-type PCB, they require specialized substrates.

In the production and manufacturing of PCB, the production principles of thick copper PCB mainly revolve around their needs to carry high current, high power, and high reliability.

Thick copper PCB play a significant role in various fields due to their excellent electrical performance and mechanical strength. Here are some of the main application areas of thick copper PCB and their explanations

Now, let’s continue to learn about the advantages of thick copper PCB. Here are some notable advantages of thick copper PCB following

Thick copper PCB, which refers to printed circuit boards with copper foil thickness greater than 3 ounces (3oz), is known for its superior electrical performance, enhanced mechanical strength, and excellent thermal performance. This special PCB design can meet the application requirements under high current, high power, and harsh environmental conditions.

New energy vehicles (NEVs) have diverse functional requirements. In electric vehicles, using a single PCB with strong processing capabilities and complex circuits may be a cost-effective solution

In the field of new energy vehicles, the functionality and environmental requirements of automotive electronics are undergoing significant changes. This transformation is primarily driven by three major trends: autonomous driving, connected vehicle networks, and the increasing number of electric vehicles.

With the continuous advancement of new energy technology, the popularity of electric bicycles is increasing, and as an essential charging device for electric bicycles, the demand for charging piles is also growing. Nowadays, we can see the presence of new energy vehicle charging piles in various parking lots and public transportation hubs, indicating a significant development space in the future charging pile market. In this development, charging pile PCB will also benefit.

Today, let's discuss some tips to avoid issues in the design of rigid-flex PCBs.

We continue to illustrate another example of rigid-flex PCB design. As shown in the cover image, a typical rigid-flex printed circuit board. It has 3 rigid PCB connected to each other through flexible circuits. Rigid-flex printed circuit boards can be folded to fit into a smaller 3D space of the final product. Another main aspect of rigid-flex printed circuit boards is their flexibility, or bendability.