Today, we delve into the unique manufacturing processes of IC substrates, which ensure their high performance and reliability:
1. Copper patterning and plating: This step is fundamental to the manufacturing process, involving precise manipulation and shaping of copper materials. By adjusting the thickness and shape of copper using specialized machinery, a solid foundation for subsequent circuit formation is laid.
2. Solder mask application: This process applies a solder mask to the substrate, combining solder mask printing technology and equipment for through-hole filling, ensuring the stability and protectiveness of the circuit.
3. Surface finishing: Including polishing and grinding the substrate to ensure its surface is uniformly smooth, which is crucial for the precision and reliability of the substrate.
Of course, like all other PCB product manufacturing processes, the production of IC substrates requires strict inspection: the integrity and reliability of the final substrate must be tested during this process.
In the next article we will learn about the key points of producing IC substrate PCB.
