Today, let's explore the fundamental characteristics of IC substrates, which are crucial for their application in high-performance electronic devices:
1. Lightweight: The lightweight nature of IC substrates is primarily due to the selection of their manufacturing materials, such as resins and certain lightweight plastics, which help reduce the overall weight of the final product, especially important in portable devices.
2. Reliable: IC substrates provide a solid protective barrier around integrated circuits, safeguarding them from physical damage and environmental factors, ensuring long-term stable operation. They are typically made from high-purity, highly stable materials to guarantee reliability.
3. Fewer wires and solder joints: Due to the miniaturized design of IC substrates, they require fewer wires and solder joints for circuit connections compared to traditional PCBs, which helps reduce manufacturing costs and improve signal transmission efficiency.
4. Compact: The compact design of IC substrates allows them to achieve more functionality within limited spaces, which is crucial for applications with space constraints such as smartphones and wearable devices.
5. Durable: Despite their small size, the durability of IC substrates enables them to withstand wear and tear from daily use and extreme environmental conditions, such as temperature fluctuations and mechanical shocks.
In the next article, we will introduce some unique manufacturing techniques for IC substrates.
