Here are the table of Chip packaging corresponding substrate types
|
Substrate types. |
Packaging methods |
Packaging names |
|
No substrate required |
Fan-Out
|
|
|
WLCSP
|
||
|
Organic substrate |
Wire-bond
|
BGA, LGA，CSP（COB, BOC, WB CSP）
|
|
Flip-Chip
|
BGA（FC BGA, FO on Substrate, 2.5D, 3D） CSP
|
|
|
Lead frame substrate |
Wire-bond
|
QFN/QFP, SOIC, TSOP, LCC, DIP
|
|
Flip-Chip
|
FC QFN
|
|
|
Ceramic substrate |
Wire-bond
|
Hi Rel
|
|
Flip-Chip
|
HTCC, LTCC
|
If you want to learn more knowledge or more information about substrates, just click the “CONTACT US” button on the top, our sales will tell you more while you are taking orders.
