In the previous news article, we introduced what flip chip is. So, what is the process flow of flip chip technology? In this news article, let's study in detail the specific process flow of flip chip technology.
The flip chip process is mainly divided into the following two steps:
1. The first step is to create bumps. There are many types of bumps, as shown in the figure on the top. The most common types include pure tin balls, copper pillars with tin balls, gold bumps, etc.
2. The second step is to place the chip onto the packaging substrate.
The process steps are as follows:
In the next new, we will learn the process about creating bumps.
