The 8-Layer 2-Stage HDI Audio Server Transmission Dedicated PCB

The 8-layer 2-stage HDI Audio Server Transmission Dedicated PCB is specifically designed for audio data processing and high-speed transmission. This product utilizes advanced 2-stage HDI processes, enabling high-density wiring within limited space to ensure high-quality audio signal transmission and low distortion.

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Product Description

Product Overview

The 8-layer 2-stage HDI Audio Server Transmission Dedicated PCB is specifically designed for audio data processing and high-speed transmission. This product utilizes advanced 2-stage HDI processes, enabling high-density wiring within limited space to ensure high-quality audio signal transmission and low distortion. The FR-4 substrate with a high glass transition temperature (TG-170) ensures the stability and reliability of the PCB in high-temperature environments. The black solder mask with white lettering and OSP surface treatment further enhance the mechanical strength and corrosion resistance of the product.

 

Product Features

 

  1. High-density wiring: 2-stage HDI process, achieving higher wiring density, suitable for high-density audio processing and transmission.
  2. Excellent signal integrity: 8-layer design ensures high-quality audio signal transmission, reducing signal distortion and interference.
  3. Good thermal stability: FR-4 substrate and high glass transition temperature (TG-170) ensure stability and reliability in high-temperature environments.
  4. Outstanding mechanical strength: Black solder mask with white lettering enhances the mechanical strength and corrosion resistance of the board.
  5. Environmental sustainability: Uses environmentally friendly materials and processes, complying with international environmental standards.

 

Technical Specifications

 

Number of layers  8 layers Minimum line width/line spacing 0.1mm/0.1mm
Raw material FR-4, TG-170 Minimum via diameter 0.2mm
Thickness 1.6mm Surface treatment method

OSP

Copper thickness(Inner/Outer) 1OZ/0.5OZ Ink color black oil white text

 

Application Areas

 

  • Professional audio equipment: Suitable for professional audio processing equipment in recording studios, radio stations, theaters, etc., ensuring high-quality audio signal transmission.
  • Audio servers: Suitable for audio servers, audio workstations, etc., meeting the demands of high-density audio data processing and transmission.
  • High-end audio systems: Suitable for high-end home theaters, professional audio systems, etc., providing low-distortion, high-fidelity audio transmission.
  • Multimedia devices: Suitable for multimedia players, smart speakers, etc., ensuring stable and high-quality audio signal transmission.

Special Production Process

 

  1. 2-stage HDI process: Multiple lamination and laser drilling processes achieve high-density interconnections, increasing wiring density and circuit complexity.
  2. Laser drilling technology: Utilizes laser drilling technology, resulting in smaller vias and more space-saving wiring, adapting to the market demand for lightweight, thin, short, and small electronic products.
  3. OSP surface treatment: Provides good solderability, protecting the PCB surface from oxidation and corrosion, ensuring soldering quality.
  4. Black solder mask with white lettering: Enhances the mechanical strength and corrosion resistance of the board, improving the product's reliability and aesthetics.

Product Summary

The 8-layer 2-stage HDI Audio Server Transmission Dedicated PCB is a high-performance, high-density PCB board, specifically designed for audio data processing and high-speed transmission. Its high-density wiring, excellent signal integrity, good thermal stability, and outstanding mechanical strength make it widely applicable in the fields of professional audio equipment, audio servers, high-end audio systems, and multimedia devices. Utilizing advanced 2-stage HDI processes and OSP surface treatment, the product ensures high performance and reliability, making it an ideal choice for modern audio equipment.

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