10-Layer 4 stage HDI Digital Transfer PCB

Product Description

Product Overview

The 10-layer, 4-stage HDI Signal Transmission PCB is a high-performance printed circuit board designed for high volume data processing and high-speed transmission. The high speed and stability of signal transmission are realized by using advanced 4-stage HDI technology combined with 10-layer structure. With its excellent performance, this PCB meets the stringent requirements of modern electronic devices for data processing and transmission speed.

Product Characteristics

1. High-speed transmission capability: Designed for high-speed signal transmission, ensuring high efficiency and low latency of data transmission.

2. Multi-layer structure design: 10-layer PCB structure provides more wiring space and optimizes signal integrity.

3. High-performance substrate: Using FR-4 substrate, with good electrical insulation performance and mechanical strength.

4. Fine line layout: The minimum line width/line distance reaches the industry-leading level, supporting more complex circuit design.

5. Durable surface treatment: gold surface treatment, improve PCB corrosion resistance and reliability.

Technical Specification

Number of layers	10	Ink color	black oil white characters
Raw material	FR-4	Minimum line width/Line distance Line width	0.1mm
Thickness	1.4mm	Size	106.40mm*298.55mm
Coppe thick	1 oz /1 oz	Surface treatment method	immersion gold

Application Field

High-performance computing: Motherboards for high-performance servers and data centers.

High-speed communication equipment: such as 5G base stations, high-speed routers, etc.

Industrial automation control: used to achieve precise control of industrial automation equipment.

Medical devices: For high-end medical imaging devices that require high-speed data processing.

Special Production Process

1. 4-stage HDI process: By using the 4-stage HDI process, finer line layout and higher wiring density are achieved, thus improving the speed and stability of signal transmission.

2. High-precision drilling technology: Ensure the accuracy of drilling and reduce the loss in signal transmission.

3. Automated production process: Using automated production lines to improve production efficiency and product quality consistency.

Product Summary

10-layer, 4-level HDI signal transmission dedicated PCB with its excellent performance and reliability to meet the needs of modern electronic equipment for high-speed data processing and transmission. By using an advanced 4-stage HDI process and 10-layer structural design, this PCB provides excellent signal integrity while guaranteeing signal transmission speed.