12-Layer HDI Electronic PCB with For Server Manufacturers, Suppliers, Factory

Product Description

Product Overview

The 12-layer HDI Electronic Server PCB is a complex operating system printed circuit board designed for high-performance electronic server equipment. It uses advanced HDI (High Density Interconnect) technology, combined with a variety of surface treatment processes, to ensure superior electrical performance and reliability. The product is widely used in electronic servers requiring high-density cabling and high-performance transmission, such as data center servers and high-performance computing servers.

Product Characteristics

1. Ultra-high wiring density: Multi-layer HDI technology is used to achieve smaller line width and line distance, improve wiring density, and meet the integration needs of complex electronic servers.

2. Excellent electrical performance: precipitation and OSP surface treatment process, providing good electrical conductivity and oxidation resistance, to ensure the stability and reliability of signal transmission.

3. High heat resistance: FR-4 TG-170 substrate has excellent heat resistance and can work stably in high temperature environment for a long time.

4. Fine solder resistance process: black oil and white word solder resistance layer, not only beautiful, but also effectively protect the PCB surface, prevent short circuit and corrosion.

5. High reliability: The 12-layer structure design enhances the mechanical strength and stability of the PCB to ensure reliability in complex working environments.

Technical Specification

Number of layers	12	Ink color	black oil white characters
Raw material	FR-4, TG-170	Minimum line width/Line distance Line width	0.1mm
Thickness	1.2mm	Size	106.40mm*298.55mm
Coppe thick	1 oz /1 oz	Surface treatment method	immersion gold, OSP

Application Field

Data Center Server: Motherboard for high-performance data center servers that support complex computing and data processing functions.

High-performance computing server: applies to high-performance computing servers, providing high-speed data transmission and processing capabilities.

Network communication equipment: such as high-performance routers, switches, etc., to meet the needs of high-speed communication and network connection.

Industrial automation control equipment: used for precision industrial automation control equipment control and data processing to ensure the stability and reliability of the equipment.

Special Production Process

1. Multi-layer HDI technology: achieve smaller line width and line distance, improve wiring density, and meet the integration needs of complex electronic servers.

2. Gold deposition and OSP process: The gold deposition process forms a uniform gold layer on the PCB surface by electrochemical deposition method, providing excellent electrical conductivity and oxidation resistance; The OSP process forms an organic protective layer on the PCB surface to prevent copper oxidation.

3. Black oil and white character welding process: The use of high-quality black oil and white character ink to ensure the beauty and functionality of the welding resistance layer.

4. High-precision drilling technology: to ensure the drilling accuracy and hole wall quality of multi-layer PCB, to meet the complex wiring and connection needs.

Product summary

The 12-layer HDI electronic server dedicated PCB is the ideal choice for high-performance electronic servers due to its ultra-high wiring density, excellent electrical performance, high heat resistance and high reliability. It can not only meet the integration needs of complex electronic servers, but also work stably in high temperature environment for a long time, providing a solid foundation for the performance improvement and reliability of electronic servers.