6-layer 1-stage HDI immersion gold PCB is a printed circuit board for complex operating systems designed for high-performance electronic devices.
Product Overview
6-layer 1-stage HDI immersion gold PCB is a printed circuit board for complex operating systems designed for high-performance electronic devices. It uses advanced HDI technology combined with immersion gold surface treatment technology to ensure excellent electrical performance and reliability. This product is widely used in electronic devices that require high-density wiring and high-performance transmission, such as smart phones, high-performance computers, communication equipment, etc.
Product Features
1. High-density wiring: Using 1-stage HDI technology to achieve smaller line width and line spacing, improve wiring density, 2. Meet the integration needs of complex electronic devices.
2. Excellent electrical performance: immersion gold surface treatment process, providing good conductivity and oxidation resistance, ensuring the stability and reliability of signal transmission.
3. High reliability: FR-4 substrate has excellent mechanical strength and heat resistance, and can work stably for a long time in harsh environments.
4. Fine solder mask process: green oil white text solder mask layer is not only beautiful, but also effectively protects the PCB surface to prevent short circuit and corrosion.
5. Accurate back drilling process: using controlled depth drilling technology to ensure the depth and accuracy of back drilling to meet complex wiring and connection requirements.
Technical Specifications
Number of layers | 6 layers | Minimum line width/line spacing | 3mil/3mil |
Raw material | FR-4 | Is there solder mask | Yes |
Thickness | 1.6mm | Surface treatment method | Immersion gold |
Copper thickness | 1OZ | Ink color | green oil white text |
Application Areas
Smartphones: Mainboards for high-performance mobile phones, supporting complex communication and data processing functions.
High-performance computers: Suitable for servers and high-performance computing devices, providing high-speed data transmission and processing capabilities.
Communication equipment: Such as routers, switches, etc., to meet the needs of high-speed communication and network connection.
Medical equipment: Used for the control and data processing of precision medical instruments to ensure the stability and reliability of the equipment.
Special Production Process
1.HDI technology: High-density interconnection technology, achieving smaller line width and line spacing, and improving wiring density.
2. Immersion gold process: Through the electrochemical deposition method, a uniform gold layer is formed on the surface of the PCB, providing excellent conductivity and oxidation resistance.
3. Controlled depth drilling technology: Precisely control the depth and accuracy of the back drilling to meet complex wiring and connection requirements.
4. Green oil and white text solder mask process: Use high-quality green oil and white text ink to ensure the beauty and functionality of the solder mask.
Product Summary
6-layer 1-stage HDI immersion gold PCB has become an ideal choice for high-performance electronic devices due to its high-density wiring, excellent electrical performance, high reliability and fine craftsmanship. It not only meets the integration requirements of complex electronic equipment, but can also work stably for a long time in harsh environments, providing a solid foundation for improving the performance and ensuring the reliability of electronic products.