The 10-layer HDI Communication PCB for high-performance mobile phones is a high density interconnect printed circuit board designed for high-performance mobile phone chip information transmission.
Product Overview
The 10-layer HDI Communication PCB for high-performance mobile phones is a high density interconnect printed circuit board designed for high-performance mobile phone chip information transmission. It uses a 10-layer structure to achieve complex circuit design and signal transmission. This PCB is widely used in high-end smart phones, mobile communication equipment and other fields for its excellent signal integrity, high-density wiring capability and excellent electrical performance.
Product Characteristics
1. High-density interconnection: 10-layer structure design, providing more wiring space, suitable for complex circuit design.
2. High-speed signal transmission: Optimized layered structure and impedance control to ensure signal transmission speed and stability.
3. Thin and light design: 1.6mm thickness, easy to integrate into compact mobile phone devices.
4. Durability: The metal surface treatment enhances the mechanical strength and corrosion resistance of the PCB.
5. Precise manufacturing: minimum aperture 0.1mm, line width/line distance 3.5/3.5MIL, to ensure fine circuit design.
Technical Specification
| Number of layers | 10 | Ink color | green oil white characters |
| Raw material | FR-4 TG170 IT180A | Minimum line width/Line distance Line width | 3.5mil |
| Thickness | 1.6mm | Solder resistance | green oil white lettering |
| Copper thickness | 1 oz /35 microns (can be customized) | Surface treatment method | sinking gold |
Application Field
High-end smartphones: Used for signal processing and data transmission inside smartphones.
Mobile communication equipment: high-speed data exchange in mobile communication equipment.
Wireless network module: Used for signal processing and transmission in wireless network module.
High-performance computing devices: Provide stable circuit support for high-performance computing devices.
Special Production Process
1. High density Interconnect technology (HDI) : The use of advanced HDI technology to achieve finer lines and smaller apertures.
2. Precise cascade structure design: Through precise control of cascade structure, optimize signal transmission path and reduce signal loss.
3. Impedance control: Accurate impedance control technology to ensure signal integrity.
4. Gold sinking process: Provide better welding performance and long-term stability.
Product Summary
With its excellent performance and reliability, the 10-layer HDI communication PCB for high-performance mobile phones is the ideal choice in the field of high-performance mobile phone communications. It can not only meet the needs of high-speed signal processing, but also provide stable performance in complex circuit designs. By employing advanced production processes and high-quality raw materials, we ensure the durability and long-term reliability of our products, making them the first choice for smartphone manufacturers.
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