10-Layer 4 Stage HDI Digital Transfer PCB (3 Pcs)

Product Description

Product Overview

The 10-layer 4-stage HDI signal transmission dedicated PCB (three-piece board) is specifically designed for extensive data processing and high-speed transmission. Compared to the previous five-piece board, this product adopts a more lightweight design, facilitating packaging and disassembly during use. This PCB board utilizes a complex 4-stage HDI process, capable of meeting the demands of high-density interconnections and high-speed signal transmission, making it suitable for various high-performance electronic devices.

Product Features

High-density routing: Utilizes a 4-stage HDI process, enabling a high density of wiring, allowing for more functional integration within limited space.
Excellent signal integrity: The 10-layer design ensures stable and intact signal transmission, reducing signal interference and transmission loss.
Good thermal stability: FR-4 substrate and gold plating surface treatment ensure stability and reliability in high-temperature environments.
Outstanding mechanical strength: Black solder mask with white lettering enhances the board's mechanical strength and corrosion resistance.
Environmental sustainability: Uses environmentally friendly materials and processes, complying with international environmental standards.

Technical Specifications

Number of layers	10 layers	Minimum line width/line spacing	3mil/3mil
Raw material	FR-4	Is there solder mask	Yes
Thickness	1.45mm	Surface treatment method	Immersion gold
Copper thickness(Inner/Outer)	1OZ/0.5OZ	Ink color	black oil white text

Application Areas

High-speed communication equipment: Suitable for 5G base stations, data centers, and other high-speed communication devices, ensuring stable high-speed signal transmission.
High-performance computing devices: Suitable for AI servers, high-performance computing clusters, etc., meeting the demands of high-density interconnections and extensive data processing.
Automotive electronics: Suitable for autonomous driving systems, vehicle radars, etc., providing high-density wiring and reliable signal transmission.
Medical equipment: Suitable for advanced medical imaging devices, vital sign monitoring equipment, etc., ensuring the high performance and stability of the devices.

Special Production Process

4-stage HDI process: Through multiple lamination and laser drilling, high-density interconnections are achieved, increasing wiring density and circuit complexity.
Laser drilling technology: Utilizes laser drilling technology, resulting in smaller vias and more space-saving wiring, adapting to the market demand for lightweight, thin, short, and small electronic products.
Gold plating surface treatment: Provides low contact resistance and good solderability, protecting the PCB surface from oxidation and corrosion.
Black solder mask with white lettering: Enhances the board's mechanical strength and corrosion resistance, improving the product's reliability and aesthetics.

Product Summary

The 10-layer 4-stage HDI signal transmission dedicated PCB (three-piece board) is a high-performance, high-density PCB board, specifically designed for high-speed signal transmission and extensive data processing. Its lightweight design, high-density wiring, excellent signal integrity, and good thermal stability make it widely applicable in the fields of high-speed communication, high-performance computing, automotive electronics, and medical equipment. Utilizing advanced 4-stage HDI processes and gold plating surface treatment, the product ensures high performance and reliability, making it an ideal choice for modern electronic devices.