8-Layer HDI Data Transfer PCB for Server

The 8-layer HDI Arbitrary Interconnect Server Processing PCB is a high-density interconnect printed circuit board designed for data upload and processing in servers.

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Product Description

Product Overview

The 8-layer HDI Arbitrary Interconnect Server Processing PCB is a high-density interconnect printed circuit board designed for data upload and processing in servers. It uses an 8-layer structure to achieve complex circuit design and signal transmission. With its excellent signal integrity, high density wiring capability and excellent electrical performance, this PCB is widely used in servers, data centers, high performance computing and other fields.

 

Product Characteristics

1. High-density interconnection: 8-layer structure design, providing more wiring space, suitable for complex circuit design.

2. High-speed signal transmission: Optimized layered structure and impedance control to ensure signal transmission speed and stability.

3.Thin and light design: 1.2mm thickness, easy to integrate into compact server equipment.

4. Durability: The metal surface treatment enhances the mechanical strength and corrosion resistance of the PCB.

5. Precise manufacturing: minimum aperture 0.1mm, line width/line distance 3.5/3.5MIL, to ensure fine circuit design.

 

Technical Specification 

Number of  layers 8 Ink color green oil white characters
Raw material FR-4 TG170 IT180A Minimum line width/Line distance Line width 3.5mil
Thickness 1.2mm Solder resistance green oil white lettering
Coppe thick 1 oz /35 microns Surface treatment method sinking gold

 

Application Field

Server: Used for signal processing and data transmission inside the server.

Data center: High-speed data exchange in data centers.

High-performance computing: Provides stable circuit support for high-performance computing.

Communication equipment: such as base stations, switches, routers, etc., for high-speed signal processing and forwarding.

 

Special Production Process

1. High density Interconnect technology (HDI) : The use of advanced HDI technology to achieve finer lines and smaller apertures.

2. Precise cascade structure design: Through precise control of cascade structure, optimize signal transmission path and reduce signal loss.

3. Impedance control: Accurate impedance control technology to ensure signal integrity.

4. Gold sinking process: Provide better welding performance and long-term stability.

 

Product Summary

8-layer HDI Arbitrary Interconnect server processing PCBS are ideal for server data processing due to their superior performance and reliability. It can not only meet the needs of high-speed signal processing, but also provide stable performance in complex circuit designs. Through the use of advanced production processes and high-quality raw materials, we ensure the durability and long-term reliability of our products, making them the first choice for communication equipment manufacturers.

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