16-layer 5-level HDI (high-density interconnect) high-frequency storage server designed for high-performance storage solutions and is widely used in data centers, cloud computing, and enterprise-level storage systems.
16-Layer 5-Order HDI High-Frequency Storage Server PCB Product Introduction
1.Product Overview
16-layer 5-level HDI (high-density interconnect) high-frequency storage server designed for high-performance storage solutions and is widely used in data centers, cloud computing, and enterprise-level storage systems. The product combines high-layer count and high-density interconnect technology to meet the needs of modern storage devices for high-speed data transmission and high reliability.
2.Product Features
1.High-layer count design:
2.16-layer structure, supporting complex circuit design, suitable for multi-function integration and high-density wiring.
3.5-level HDI technology:
4.Adopting advanced 5-level HDI design, it can achieve smaller line spacing and higher line density, optimizing space utilization.
Supporting micro blind hole and buried hole technology to improve the reliability and stability of signal transmission.
5.High-frequency performance:
6.Design optimization to support high-frequency signal transmission, suitable for high-speed data storage and processing needs.
Low resistance and low inductance characteristics to ensure signal integrity and transmission efficiency.
7.Superior heat dissipation performance:
8.Adopting high thermal conductivity materials and optimized heat dissipation design to ensure heat dissipation effect under high load operation and extend product life.
9.Multiple material options:
10.Different substrates can be provided according to customer needs, such as FR-4, Rogers, etc., to meet different electrical performance requirements.
3.Application Areas
Data center: used for high-performance storage servers, supporting large-scale data processing and storage.
Cloud computing: Provide efficient data transmission and storage solutions for cloud services.
Enterprise storage: Suitable for enterprise storage devices such as NAS and SAN.
High-frequency trading: Meet the needs of the financial industry for low latency and high-frequency trading.
4.Technical Parameters
| Material | R-5775 | Minimum line width/line spacing | 3/3mil |
| Number of layers | 16 layers | Ink color | blue oil white text |
| Board thickness | 3.2mm | Surface process | Immersion gold |
| Minimum aperture | 0.1MM | / | / |
5.Production Process
Precision etching: Ensure the fineness and accuracy of the line to meet the requirements of high-density wiring.
Multi-layer lamination: Achieve the stability and reliability of multi-layer boards through high temperature and high pressure processes.
Surface treatment: Provide a variety of surface treatment methods, such as ENIG, HASL, etc., to meet different needs.
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6.Quality Control
Strict testing standards: including electrical performance testing, thermal cycle testing, mechanical strength testing, etc., to ensure product reliability.
ISO certification: in line with international standards to ensure product quality and consistency.
7.Summary
16-layer 5-order HDI high-frequency storage server circuit board is the core component of modern high-performance storage solutions. With its high density, high frequency and superior electrical characteristics, it meets the needs of various high-end applications. We are committed to providing customers with high-quality HDI circuit board solutions to help customers gain an advantage in the fierce market competition.
FAQ
1.Q: How far is your factory from the nearest airport?
A: About 30 kilometers
2.Q: What is your minimum order quantity?
A: One piece is enough to place an order.
3.Q: Do you have laser drilling machines?
A: We have the most advanced laser drilling machine in the world.
4.Q: How many layers of HDI can your company produce?
A: We can produce from four layers of first order to high multi-layer arbitrary interconnect PCB circuit boards.
5.Q: How to solve the common overheating problems when using communication PCB boards?
A: The key is to introduce heat dissipation design and or choose high quality materials. For example: EMC, TUC, Rogers and other companies to provide the board.
6.Q: How to avoid high-frequency and high-speed PCB circuit board common signal interference?
A: The need to optimize the PCB layout and reasonable planning of the ground to reduce the impact of interference.
