The four-layer power supply PCB with inner and outer of 2OZ is a printed circuit board designed for power management and high current applications.
Four-Layer PCB with Inner And Outer Of 2OZ Product Introduction
1.Product Overview
The four-layer power supply PCB with inner and outer of 2OZ is a printed circuit board designed for power management and high current applications. The PCB adopts a four-layer structure, and both the inner and outer layers use 2OZ thick copper, which can effectively meet the needs of modern electronic equipment for power stability, heat dissipation performance and signal integrity.
2.Main Features
Four-layer structure:
The four-layer design can effectively separate the power and signal layers, reduce electromagnetic interference, and improve the stability and reliability of the circuit.
2OZ thick copper:
The inner and outer layers use 2OZ (about 70μm) thick copper, which significantly improves the carrying capacity of the power line, reduces resistance, reduces heat generation, and improves the overall power efficiency.
Excellent thermal management:
The thick copper design helps to quickly dissipate heat, ensure the stable operation of the circuit under high load, and is suitable for high power applications.
High current carrying capacity:
Suitable for applications requiring high current, such as power modules, power amplifiers, and high-performance computing devices.
Good anti-interference ability:
Through reasonable stacking design and grounding layer configuration, electromagnetic interference (EMI) is effectively reduced and signal integrity is improved.
3.Technical Parameters
| Number of layers | 4 | Copper thickness | 2OZ inner and outer layers |
| Board thickness | 1.6mm | Minimum line width and line spacing | 0.3/0.3MM |
| Board material | KB-6160 | Minimum aperture | 0.3 |
| Solder mask | green oil white text | Surface treatment | immersion tin Process |
4.Structure
Four-layer power inner and outer layers 2OZ copper thick PCB circuit board usually consists of the following layers:
First layer: signal layer, responsible for the main signal transmission.
Second layer: power layer, providing stable power distribution.
Third layer: ground layer, enhancing the anti-interference ability of the circuit.
Fourth layer: signal layer, further transmitting signals.
5.Application Areas
Power management module: used for various power conversion and management equipment.
High-performance computing: such as servers, data centers and high-performance computers.
Communication equipment: such as base stations, routers and other network equipment.
Industrial equipment: such as robots, automation equipment and control systems.
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6.Conclusion
The four-layer power supply inner and outer layers 2OZ copper thick PCB circuit board has become an indispensable component in modern high-power electronic devices due to its excellent power management capabilities and thermal management performance. With the continuous advancement of technology and the increase in application needs, its market demand will continue to grow, providing more efficient and reliable power solutions for various industries.
FAQ
Q: How many employees do you have in your factory?
A: More than 500.
Q: Are the materials you use environmentally friendly?
A: The materials we use are in accordance with ROHS standard and IPC-4101 standard.
Q: How to solve the common overheating problems when using power PCB ?
A: The key is to introduce heat dissipation design and or choose high quality materials. For example: EMC, TUC, Rogers and other companies to provide the board.
Q: How long does it generally take to deliver HDI high-frequency PCB?
A: We have raw material inventory (such as RO4350B, RO4003C, etc.), and our fastest delivery time can be 3-5 days.
