2-layer ENIG power PCB is designed for power management and signal transmission.
2-Layer Immersion Gold Power PCB Product Introduction
1.Product Overview
2-layer ENIG power PCB is designed for power management and signal transmission. Its double-sided circuit layout and ENIG surface treatment ensure excellent conductivity and durability, suitable for various high-frequency and high-power applications.
2.Product Features
1.Double-sided design
2.Adopting a 2-layer structure, it is easy to realize complex circuit connections and improve design flexibility and compactness.
3.ENIG surface treatment
4.Adopting ENIG (ENIG) process, it provides excellent conductivity and wear resistance, suitable for high-frequency signal transmission and reduces contact resistance.
5.Good electrical performance
6.Design optimization ensures signal integrity, suitable for applications with high requirements for power and signal quality.
7.Excellent heat dissipation performance
8.Suitable for high-power applications, can effectively reduce the temperature of the circuit board and improve the stability and reliability of the system.
9.Durability
10.Adopting high-quality materials, it has good corrosion resistance and oxidation resistance, suitable for various environmental conditions.
3.Application Areas
Power management
Suitable for power management systems such as switching power supplies and DC-DC converters.
Industrial equipment
Widely used in industrial control, automation equipment and other fields.
Communication equipment
Suitable for high-frequency communication equipment such as base stations and communication modules.
Consumer electronics
Provide stable power support in high-performance consumer electronics products.
Technical Specifications
| Number of layers | 2 layers | Minimum aperture | 0.2 mm |
| Copper thickness | 1 oz | Minimum line width | 0.1 mm |
| Board material | FR-4 KB6160 | Surface treatment | ENIG |
| Solder mask color | green oil with white text | / | / |
Production Process
1.Design phase
2.Use professional PCB design software for circuit design and layout.
3.Material selection
4.Select the appropriate substrate and copper thickness according to customer needs.
5.Manufacturing phase
6.Perform processes such as photolithography, etching, drilling, and lamination.
7.Surface treatment
8.Use ENIG process for surface treatment to ensure good conductivity and durability.
9.Testing phase
10.Conduct electrical tests and reliability tests to ensure product quality.
11.Delivery phase
12.After completion, pack and ship to ensure that the product reaches the customer safely.
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Conclusion
2-layer immersion gold power circuit board is an ideal choice for high-performance power solutions and is suitable for a variety of high-power and high-frequency applications. With its superior electrical performance, heat dissipation capability and durability, it can meet the stringent requirements of modern electronic devices for power supply.
FAQ
1.Q: Do you have an office address that could be visited?
A: Our office address is Tianyue Building, Bao 'an District, Shenzhen.
2.Q: Will you attend the exhibition to show your products?
A: We are planning on it.
3.Q: Why do dark and granular solder joints appear on power PCB, and how can this be addressed?
A: This may be due to contaminated solder or an excess of oxides mixed into the molten solder, resulting in brittle solder joint structures. It is necessary to use solder with an appropriate tin content and control the composition of the solder during the manufacturing process to reduce impurities.
4.Q: What to do if there is an open circuit in the power PCB, preventing signals from being transmitted normally?
A: This can be addressed by ensuring precise welding techniques, inspecting the physical quality of the PCB, and adjusting the trace width to enhance the mechanical strength of the circuit board.
