8-layer module thick copper power circuit board is a high-performance printed circuit board designed for power management and high-power applications.
8 Layer Module PCB Product Introduction
1.Product Overview
8-layer module thick copper power circuit board is a high-performance printed circuit board designed for power management and high-power applications. The circuit board adopts a multi-layer structure, combined with thick copper technology, which can effectively meet the needs of modern electronic devices for power stability, heat dissipation performance and signal integrity.
2.Main Features
Multi-layer design:
8-layer structure provides larger wiring space, which can effectively separate the power and signal layers, reduce interference and improve the stability of the circuit.
Thick copper technology:
The use of thick copper (usually 3 oz or higher) can significantly improve the carrying capacity of the power line, reduce resistance, reduce heat generation, and improve overall power efficiency.
Excellent thermal management:
Multi-layer structure and thick copper design help to quickly dissipate heat, ensure stable operation of the circuit under high load, and are suitable for high-power applications.
High current carrying capacity:
Suitable for applications requiring high current, such as power modules, power amplifiers and high-performance computing devices.
Good anti-interference ability:
Effectively reduce electromagnetic interference (EMI) and improve signal integrity through reasonable stacking design and ground layer configuration.
3.Technical Parameters
| Number of layers | 8 | Minimum aperture | 0.35mm |
| Board thickness | 2.6mm | Surface treatment | immersion gold |
| Solder mask | green oil with white characters | Application area | power supply |
| Board material | FR4 SY1000-2 | Copper thickness | 4OZ inner and outer layers |
4.Structure
8-layer module thick copper power circuit board usually consists of the following layers:
First layer: signal layer, responsible for the main signal transmission.
Second layer: power layer, providing stable power distribution.
Third layer: ground layer, enhancing the anti-interference ability of the circuit.
Fourth layer: signal layer, further transmitting signals.
Fifth layer: power layer, providing additional power support.
Sixth layer: ground layer, further enhancing electrical performance.
Seventh layer: signal layer, responsible for high-frequency signal transmission.
Eighth layer: protective layer, providing mechanical support and protection.
5.Application Area
Power management module: used for various power conversion and management equipment.
High-performance computing: such as servers, data centers and high-performance computers.
Communication equipment: such as base stations, routers and other network equipment.
Industrial equipment: such as robots, automation equipment and control systems.
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6.Conclusion
The 8-layer module thick copper power circuit board has become an indispensable component in modern high-power electronic devices due to its excellent power management capabilities and thermal management performance. With the continuous advancement of technology and the increase in application needs, its market demand will continue to grow, providing more efficient and reliable power solutions for various industries.
FAQ
Q: What files are used in PCB production?
A: PCB production requires Gerber files and PCB manufacturing specifications, such as the required substrate material, finished thickness, copper layer thickness, solder mask color, and design layout requirements.
Q: When can I get a quotation after I provide Gerber, product process requirements?
A: Our sales staff will give you a quotation within 1 hour.
Q: How to resolve short circuits and open circuits in power PCB?
A: Short circuits and open circuits are usually caused by circuit aging or manufacturing defects, and need to be resolved through careful inspection and professional repair methods.
Q: Do you have laser drilling machines?
A: We have the most advanced laser drilling machine in the world.
