The 14-layer power module PCB circuit board is a highly complex, high-performance multi-layer circuit board designed for high-power, high-density power modules.
14 Layer Module PCB Circuit Board Product Introduction
The 14-layer power module PCB circuit board is a highly complex, high-performance multi-layer circuit board designed for high-power, high-density power modules. This PCB circuit board has excellent electrical performance, heat dissipation performance and reliability, and is widely used in communication equipment, servers, data centers, aerospace and industrial control and other fields. The following is a detailed introduction to the 14-layer power module PCB circuit board product.
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1. Product Overview
The 14-layer power module PCB circuit board adopts a multi-layer structure design, which can achieve high-density integration of complex circuits. Through advanced manufacturing processes and high-quality materials, the stable operation of the power module in high-power, high-frequency and high-temperature environments is ensured.
2. Product Features
2.1 High-density integration
The 14-layer design can achieve high-density integration of complex circuits, reduce the volume and weight of the system, and improve the overall performance.
2.2 Excellent electrical performance
The use of high-quality copper foil and precise wiring design provides excellent electrical performance and ensures the efficient operation of the power module.
2.3 Excellent heat dissipation performance
Through multi-layer design and reasonable heat dissipation path, the heat dissipation capacity of the PCB is significantly improved to meet the needs of high-power power supplies.
2.4 High reliability
Using high-quality substrates and advanced manufacturing processes to ensure the reliability of PCB in harsh environments such as high temperature, high humidity and high vibration.
2.5 High anti-interference ability
Through reasonable circuit design and shielding technology, the anti-electromagnetic interference ability of PCB is improved to ensure the stability and safety of the power module.
3. Technical Parameters
| Number of layers | 14 | Minimum line width and line spacing | 0.6/0.6MM |
| Board thickness | 3.2mm | Minimum aperture | 0.4 |
| Board material | S1000-2M | Surface treatment | 2U immersion gold |
| Copper thickness | 3OZ for inner layer 2oz for outer layer | Process points | thick copper board |
4. Application Areas
4.1 Communication equipment
Used for circuit control and power transmission of communication equipment power modules, providing high reliability and high performance power solutions.
4.2 Server
Used for circuit control and power transmission of server power modules, ensuring efficient power conversion and stable output.
4.3 Data center
Used for circuit control and power transmission of data center power modules, providing high reliability and long life power solutions.
4.4 Aerospace
Used for circuit control and power transmission of aerospace power modules, ensuring system stability and reliability.
4.5 Industrial control
Used for circuit control and power transmission of industrial control power modules, meeting the needs of high power and high reliability.
5. Manufacturing Process
5.1 Circuit Design
Use EDA tools to design and route circuits to ensure the rationality and reliability of the circuit.
5.2 Material Selection
Select high-quality substrates and copper foils to ensure the performance and reliability of the PCB.
5.3 Etching
Perform etching to form circuit patterns.
5.4 Vias
Drill holes and perform electroplating to form vias.
5.5 Lamination
Laminate 14 layers of copper foil with the substrate to form a multi-layer PCB.
5.6 Surface Treatment
Perform surface treatment such as HASL, ENIG, etc. to improve the welding performance and corrosion resistance of the PCB.
5.7 Welding
Weld components to complete assembly.
5.8 Testing
Perform electrical and functional testing to ensure product quality.
6. Quality Control
6.1 Raw Material Inspection
Ensure that the quality of the substrate and copper foil meets the standards.
6.2 Manufacturing Process Control
Strictly control each process to ensure product consistency and reliability.
6.3 Finished Product Testing
Perform electrical performance testing, functional testing, and environmental testing to ensure that the product meets the design requirements.
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7. Conclusion
The 14-layer power module PCB circuit board is widely used in various high-power and high-density power modules due to its high-density integration, excellent electrical performance and high reliability. Through reasonable design and strict manufacturing process, efficient and reliable power solutions can be achieved to meet the diverse power system requirements.
I hope this product introduction will be helpful to you!
FAQ
Q: Do you have an office address that could be visited?
A: Our office address is Tianyue Building, Bao 'an District, Shenzhen.
Q: Will you attend the exhibition to show your products?
A: We are planning on it.
Q: How to avoid common signal interference of power PCB?
A: The need to optimize the PCB layout and reasonable planning of the ground to reduce the impact of interference.
Q: Can you provide samples?
A: We have the ability to quickly proof-sample PCB and provide comprehensive technical support.
