The 4-layer embedded memory card (EMMC) PCB is a high-performance printed circuit board designed for embedded multimedia memory cards.
Product Overview
The 4-layer embedded memory card (EMMC) PCB is a high-performance printed circuit board designed for embedded multimedia memory cards. This 4-layer PCB is an ideal choice for EMMC storage solutions with its excellent electrical performance, fine line layout and stable reliability. It adopts advanced manufacturing technology to achieve fast transmission of lines and efficient heat dissipation, meeting the needs of storage devices for high performance and high reliability.
Product Features
1. Four-layer structure design: provides more wiring layers to optimize signal integrity and power management.
2. Ultra-thin substrate: The ultra-thin thickness of 0.21mm provides extreme space utilization for EMMC memory cards.
3. Fine line layout: The minimum line width/line spacing is 0.04mm, which realizes high-density wiring and improves signal transmission speed.
4. Environmentally friendly solder mask ink: PSR-4000 AUS308 environmentally friendly solder mask provides clear visual contrast while protecting the circuit from the external environment.
5. Diversified surface treatment: Electrically soft gold, BGA and OSP surface treatments provide diverse welding and connection options.
Technical Specifications
| Number of layers | 4 layers | Ink color | Customized according to customer requirements |
| Raw materials | MGC-HL832 NS | Minimum line width/line spacing Line width | 0.04mm |
| Thickness | 0.21mm | Solder mask | Yes, PSR-4000 AUS308 |
| Copper thickness | 1 oz/35 microns | Surface treatment | ENIG, BGA, OSP |
Application
1. Embedded multimedia memory card (EMMC)
2. Internal storage of smartphones and tablets
3. In-vehicle infotainment system storage
4. Industrial control equipment storage solutions
5. Security monitoring system storage
Special Production Process
Mechanical drilling process: The through hole adopts mechanical drilling process, and the hole diameter is accurate to 0.1mm to ensure the stability and accuracy of the connection.
Electro-soft gold surface treatment: Through electro-soft gold treatment, the welding performance and corrosion resistance are enhanced, suitable for use in various environments.
BGA surface treatment: Suitable for ball grid array packaging, providing stable chip connection.
OSP surface treatment: organic tin coating provides an additional protective layer to prevent oxidation and enhance soldering performance.
Fine line processing: high-precision equipment is used for line processing to ensure that the minimum line width/line spacing reaches 0.04mm, meeting the needs of high-density circuit design.
Product Summary
The 4-layer embedded memory card (EMMC) PCB has become a leading choice in the EMMC storage field with its four-layer structural design, ultra-thin substrate, fine line layout and diversified surface treatment. This PCB not only meets the needs of storage devices for high performance and high reliability, but also provides excellent performance and reliability through special production processes. It is an ideal choice for storage device manufacturers and electronic engineers to help your products stand out in the market.
FAQ
Q: What files are used in PCB production?
A: PCB production requires Gerber files and PCB manufacturing specifications, such as the required substrate material, finished thickness, copper layer thickness, solder mask color, and design layout requirements.
Q: When can I get a quotation after I provide Gerber, product process requirements?
A: Our sales staff will give you a quotation within 1 hour.
Q: How to prevent accidental data erasure when manufacturing storage type PCB?
A: To prevent accidental data erasure during the manufacturing process of storage type PCB, strict anti-static measures need to be implemented on the production line, and all operators must wear appropriate anti-static equipment. At the same time, high-power electromagnetic devices should be avoided near storage devices to reduce electromagnetic interference. During programming and testing stages, professional equipment and software should be used to ensure that write operations on storage devices are only performed when necessary.
Q: How long does it generally take to deliver HDI high-frequency PCB?
A: We have raw material inventory (such as RO4350B, RO4003C, etc.), and our fastest delivery time can be 3-5 days.
