The 4-layer DDR4 memory PCB is a high-performance printed circuit board designed for the fourth-generation double data rate synchronous dynamic random access memory (DDR4 SDRAM).
Product Overview
The 4-layer DDR4 memory PCB is a high-performance printed circuit board designed for the fourth-generation double data rate synchronous dynamic random access memory (DDR4 SDRAM). This 4-layer PCB is an ideal choice for DDR4 memory modules with its excellent electrical performance, fine line layout and stable reliability. It adopts advanced manufacturing technology to achieve fast transmission and efficient heat dissipation of the line, meeting the strict requirements of high-speed memory for performance and reliability.
Product Features
1. Four-layer structure design: provides more wiring layers, optimizes signal integrity and power management, and is suitable for high-speed data transmission.
2. Ultra-thin substrate: The ultra-thin thickness of 0.23mm provides extreme space utilization for DDR4 memory modules.
3. Fine line layout: The minimum line width/line spacing is 0.035mm, which realizes high-density wiring and improves signal transmission speed.
4. Environmentally friendly solder mask ink: PSR-4000 AUS308 environmentally friendly solder mask provides clear visual contrast while protecting the circuit from external environmental influences.
5. Diverse surface treatment: ENIG, BGA and OSP surface treatment, providing diverse welding and connection options.
Technical Specifications
| Number of layers | 4 layers | Ink color | Customized according to customer requirements |
| Raw materials | MGC-HL832 NS | Minimum line width/line spacing Line width | 0.035mm |
| Thickness | 0.23mm | Solder mask | Yes, PSR-4000 AUS308 |
| Copper thickness | 1 oz/35 microns | Surface treatment | ENIG, BGA, OSP |
Application
1. Fourth-generation double data rate synchronous dynamic random access memory (DDR4 SDRAM)
2. High-performance computer memory modules
3. Server and data center storage solutions
4. High-speed graphics processing unit (GPU) memory
5. Industrial control and automation equipment memory
Special Production Process
Laser drilling process: The vias are laser drilled with a hole diameter of 0.06mm to ensure the stability and accuracy of the connection.
Electrically soft gold surface treatment: Through electrically soft gold treatment, the welding performance and corrosion resistance are enhanced, suitable for use in various environments.
BGA surface treatment: Suitable for ball grid array packaging, providing stable chip connection.
OSP surface treatment: Organic tin covering, providing an additional protective layer to prevent oxidation and enhance welding performance.
Fine line processing: High-precision equipment is used for line processing to ensure that the minimum line width/line spacing reaches 0.035mm, meeting the needs of high-density circuit design.
Product Summary
The 4-layer DDR4 storage PCB has become a leading choice in the field of DDR4 memory modules with its four-layer structural design, ultra-thin substrate, fine line layout and diversified surface treatment. This PCB not only meets the needs of high-speed memory for high performance and high reliability, but also provides excellent performance and reliability through special production processes. It is an ideal choice for memory module manufacturers and electronic engineers to help your products stand out in the market.
FAQ
Q: How far is your factory from the nearest airport?
A: About 30 kilometers
Q: What is your minimum order quantity?
A: One piece is enough to place an order.
Q: How to ensure data reliability when designing a storage type PCB?
A: The key to ensuring data reliability when designing a storage type PCB lies in selecting the right storage devices and layout. High-reliability non-volatile storage devices, such as EEPROM or Flash memory, should be used, and they should be kept away from high-temperature and high-interference areas. In addition, the design should consider adequate protective measures, such as ESD protection and reverse polarity protection, as well as appropriate wiring strategies to reduce signal interference and improve data transmission stability.
Q: Can you manufacture HDI printed circuit board substrates?
A: We can manufacture any interconnect PCB from four-layer, one-layer to 18-layer HDI.
