16-layer 4-level HDI new energy vehicle dedicated PCB is a high-density interconnection printed circuit board designed for complex operating systems of new energy vehicles.
Product Overview
16-layer 4-level HDI new energy vehicle dedicated PCB is a high-density interconnection printed circuit board designed for complex operating systems of new energy vehicles. This 16-layer PCB has become an ideal choice for new energy vehicle electronic systems with its excellent electrical performance, fine line layout and stable reliability. It adopts advanced 4-level HDI technology and resin plugging process to achieve fast transmission and efficient heat dissipation of lines, meeting the strict requirements of new energy vehicles for performance and reliability.
Product Features
1.16-layer high-density interconnection: provides more wiring layers, optimizes signal integrity and power management, and is suitable for high-speed data transmission.
2.4-level HDI process: adopts complex 4-level HDI process to achieve higher circuit density and complexity, and improve data transmission speed.
3. Fine line layout: the minimum line width/line spacing is 0.035mm, which realizes high-density wiring and improves signal transmission speed.
4. Environmentally friendly solder mask ink: green oil white text environmentally friendly solder mask, providing clear visual contrast while protecting the circuit from the external environment.
5. Resin plugging technology: improves the mechanical strength and electrical performance of the PCB and ensures signal integrity.
Technical Specifications
| Number of layers | 16 layers | Ink color | Green ink with white characters |
| Raw material | SY1000 | Minimum line width/line spacing Line width | 0.035mm, |
| Thickness | 0.8mm | Solder mask | Yes, green ink with white characters |
| Copper thickness | 1 ounce/35 microns | Surface treatment | Resin plugging |
Application
1. Electronic control unit of new energy vehicles
2. Battery management system of electric vehicles
3. Intelligent driving assistance system
4. In-vehicle infotainment system
5. Data processing of automotive sensors and actuators
Special Production Process
4-stage HDI process: Adopt micro-blind buried hole technology and laser laser technology to achieve high-density circuit layout.
Resin plugging process: Improve the mechanical strength and electrical performance of PCB through resin plugging to ensure signal integrity.
Lamination technology: Use heat and pressure to bond the inner and outer layers of PCB together to form a solid multi-layer PCB.
Fine line processing: Use high-precision equipment for line processing to ensure that the minimum line width/line spacing reaches 0.035mm, meeting the needs of high-density circuit design.
Product Summary
The 16-layer 4-level HDI new energy vehicle dedicated PCB has become a leading choice in the field of new energy vehicles with its 16-layer high-density interconnection, 4-level HDI process, fine line layout and resin plugging technology. This PCB not only meets the needs of new energy vehicles for high performance and high reliability, but also provides excellent performance and reliability through special production processes. It is an ideal choice for new energy vehicle manufacturers and electronic engineers, helping your products stand out in the market.
