The 6-layer HDI PCB is a high-performance printed circuit board designed for high-speed electronic communication signal processing. It uses a 6-layer structure design to meet the needs of complex electronic devices for signal transmission speed and stability.
Product Overview
The 6-layer HDI PCB is a high-performance printed circuit board designed for high-speed electronic communication signal processing. It uses a 6-layer structure design to meet the needs of complex electronic devices for signal transmission speed and stability. With its excellent signal integrity, high density wiring capability and excellent electrical performance, the product is widely used in communication base stations, data centers, high-end servers and other fields.
Product Characteristics
1. High-density wiring: 6-layer structure design, providing more wiring space, suitable for complex circuit design.
2. High-speed signal transmission: Optimized layered structure and impedance control to ensure signal transmission speed and stability.
3. Excellent electrical performance: The use of high-quality FR-4 substrate to provide good electrical insulation performance.
4. Durability: 1.6mm thickness and gold surface treatment, enhance the mechanical strength and corrosion resistance of the PCB.
5. Precise manufacturing: the minimum aperture is 0.1mm, the minimum line width/line distance can reach the industry-leading standard, to ensure fine circuit design.
Technical Specification
| Number of layers | 6 | Ink color | green oil white characters |
| Raw material | FR-4 TG170 IT180A | Minimum line width/Line distance Line width | 3mil |
| Thickness | 1.6mm | Solder resistance | green oil white lettering |
| Copper thick | 1 oz /35 microns | Surface treatment method | sinking gold |
Application Field
Communication base station: used for signal processing and data transmission inside the base station.
Data center: High-speed data exchange between servers and storage devices.
High-end server: Provides stable circuit support for high-performance computing.
Network equipment: such as routers, switches, etc., for high-speed signal processing and forwarding.
Special Production Process
1. High density Interconnect technology (HDI) : The use of advanced HDI technology to achieve finer lines and smaller apertures.
2. Precise cascade structure design: Through precise control of cascade structure, optimize signal transmission path and reduce signal loss.
3. Impedance control: Accurate impedance control technology to ensure signal integrity.
4. Gold sinking process: Provide better welding performance and long-term stability.
Product Summary
The 6-layer electronic communication connection HDI PCB is the ideal choice in the field of electronic communication due to its excellent performance and reliability. It can not only meet the needs of high-speed signal processing, but also provide stable performance in complex circuit designs. Through the use of advanced production processes and high-quality raw materials, we ensure the durability and long-term reliability of our products, making them the first choice for communication equipment manufacturers. Product overview
