The PCB for 6-layer Communication HDI Intercom system is a high density interconnect printed circuit board designed for short distance communication signal processing.
Product Overview
The PCB for 6-layer Communication HDI Intercom system is a high density interconnect printed circuit board designed for short distance communication signal processing. It uses a 6-layer structure to achieve complex circuit design and signal transmission. With its excellent signal integrity, high density wiring capability and excellent electrical performance, this PCB is widely used in walkie-talkies, wireless communication equipment and other fields.
Product Characteristics
1. High-density wiring: 6-layer structure design, providing more wiring space, suitable for complex circuit design.
2. High-speed signal transmission: Optimized layered structure and impedance control to ensure signal transmission speed and stability.
3. Thin and light design: 0.8mm thickness, easy to integrate into portable communication equipment.
4. Durability: The metal surface treatment enhances the mechanical strength and corrosion resistance of the PCB.
5. Precise manufacturing: minimum aperture 0.1mm, line width/line distance 4/4MIL, to ensure fine circuit design.
Technical Specification
| Number of layers | 6 | Ink color | green oil white characters |
| Raw material | FR-4 TG170 IT180A | Minimum line width/Line distance Line width | 4mil |
| Thickness | 0.8mm | Solder resistance | green oil white lettering |
| Copper thick | 1 oz /35 microns | Surface treatment method | sinking gold |
Application Field
Walkie-talkie: Used for signal processing and data transmission inside the walkie-talkie.
Wireless communication equipment: high-speed data exchange in wireless communication equipment.
Security monitoring system: used for signal processing and transmission in security monitoring equipment.
Portable communication equipment: Suitable for a variety of portable communication equipment requiring thin and light design.
Special Production Process
1. High density Interconnect technology (HDI) : The use of advanced HDI technology to achieve finer lines and smaller apertures.
2. Precise cascade structure design: Through precise control of cascade structure, optimize signal transmission path and reduce signal loss.
3. Impedance control: Accurate impedance control technology to ensure signal integrity.
4. Gold sinking process: Provide better welding performance and long-term stability.
Product Summary
6-layer communication HDI intercom system dedicated PCB with its excellent performance and reliability, become the ideal choice in the field of short distance communication. It can not only meet the needs of high-speed signal processing, but also provide stable performance in complex circuit designs. Through the use of advanced production processes and high-quality raw materials, we ensure the durability and long-term reliability of our products, making them the first choice for communication equipment manufacturers.
