Product Overview
The 8-layer HDI PCB for 800G optical communication modules is a high-performance printed circuit board designed specifically for high-speed transmission of optical communication signals. It features an advanced 8-layer HDI structure, combined with high-performance Pana M6 substrate and 2u gold plating surface treatment, ensuring excellent electrical performance and reliability. The product has high-density wiring and precision manufacturing processes, meeting the stringent requirements of 800G optical communication modules for high precision and high reliability.
Product Features
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High-density Wiring: The 8-layer structure design achieves smaller line width and line spacing (0.075mm/0.075mm), increasing wiring density to meet the needs of complex optical communication signal transmission systems.
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Excellent Electrical Performance: 2u gold plating surface treatment provides good conductivity and oxidation resistance, ensuring stable and reliable signal transmission.
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High Reliability: Pana M6 substrate with Tg185 has excellent mechanical strength and heat resistance, ensuring long-term stable operation in high-temperature environments.
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Precise Solder Mask Process: Green solder mask with white text, not only aesthetically pleasing but also effectively protects the PCB surface, preventing short circuits and corrosion.
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High-precision Vias: The minimum via diameter is 0.2mm, ensuring precise installation and good electrical connection for optical communication modules.
Technical Specifications
| Number of layers |
8 layers |
Minimum line width/line spacing |
0.075mm/0.075mm |
| Raw material |
Pana M6, Tg185 |
Minimum Via Diameter |
0.2mm |
| Thickness |
1.0mm |
Surface treatment method |
immersion gold 2u |
| Copper thickness(Inner/Outer) |
1OZ/1OZ |
Ink color |
green oil white text |
Application Areas
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800G Optical Communication Modules: Suitable for signal transmission and processing in 800G optical communication modules, providing high-speed data transmission and processing capabilities.
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Data Centers: Used in optical communication equipment in data centers, supporting high-speed data transmission and processing.
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Communication Base Stations: Suitable for optical communication equipment in communication base stations, ensuring stable signal transmission.
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High-performance Computing: Used in optical communication modules of high-performance computing devices, improving the communication efficiency and reliability of the equipment.
Special Production Process
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HDI Technology: Micro blind/buried vias technology is used to achieve interconnections between different layers of copper, increasing wiring density and space utilization.
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Gold Plating Process: Through electrochemical deposition, a uniform layer of gold is formed on the PCB surface, providing excellent conductivity and oxidation resistance.
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High-precision Drilling Technology: Ensures the precision of the minimum via diameter of 0.2mm, meeting the precise installation and good electrical connection requirements of optical communication modules.
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Precise Solder Mask Process: Uses high-quality green solder mask and white text ink, ensuring the aesthetics and functionality of the solder mask layer.
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Strict Quality Control: From raw material procurement to the production process, strict quality control is implemented to ensure the reliability and stability of the product.
Product Summary
The 8-layer HDI PCB for 800G optical communication modules, with its high-density wiring, excellent electrical performance, high reliability, and precise manufacturing processes, is the ideal choice for 800G optical communication modules. It not only meets the stringent requirements of 800G optical communication modules for high precision and high reliability but also ensures long-term stable operation in high-temperature environments, providing a solid foundation for the performance enhancement and reliability of optical communication equipment.
