The 8-layer 2-stage HDI automotive industrial PCB is a high-reliability circuit board designed for high-performance automotive assembly production line equipment.
Product Overview
The 8-layer 2-stage HDI automotive industrial PCB is a high-reliability circuit board designed for high-performance automotive assembly production line equipment. The 8-layer structure and 2-stage HDI process, combined with SY1001 substrate and immersion gold surface treatment, ensure the high performance and durability of the circuit board. This product has passed the flying probe test to ensure the stability and reliability of the product.
Product Features
1. High reliability design: The 8-layer structure provides stable circuit support and is suitable for high-performance automotive equipment.
2. Fine circuit layout: The 2-stage HDI process achieves a finer circuit layout to meet the needs of complex circuit design.
3. Durable surface treatment: The immersion gold surface treatment enhances the corrosion resistance and wear resistance of the circuit board, which is suitable for harsh automotive industrial environments.
4. Accurate flying probe test: Ensure the performance and reliability of each PCB board to meet the high standards of the automotive industry.
5. Environmentally friendly materials: Use SY1001 substrate, meet environmental protection requirements, and reduce the impact on the environment.
Technical Specifications
| Number of layers | 8 layers | Ink color | Green oil with white characters |
| Raw material | SY1001 | Minimum line width/line spacing | Based on 2-stage HDI process, more sophisticated circuit design is achieved |
| Thickness | 6.0mm | Solder mask | Yes |
| Copper thickness | 1OZ inner layer, 1OZ outer layer | Surface treatment method | Immersion gold (ENIG) |
Application Areas
High-performance automotive assembly line
Automotive electronic control system
Automotive sensors and actuators
In-vehicle entertainment and information system
Automotive safety and monitoring system
Special Production Process
1.2-stage HDI process: Through micro-blind/buried hole technology, high-density line interconnection is achieved to improve the space utilization of the circuit board.
2. Flying probe test: Using advanced flying probe test technology to ensure that every connection point of the circuit board is strictly tested to improve the reliability of the product.
Product Summary
8-layer 2-stage HDI automotive industry PCB has become an ideal choice for high-performance automotive assembly production line equipment with its excellent performance, fine line layout and high reliability. Combining 2-stage HDI process and immersion gold surface treatment technology, this product can meet the automotive industry's stringent requirements for circuit boards and provide strong support for the stable operation of automotive electronic systems.
