12-layer HDI resin plug hole PCB is a high-density interconnection printed circuit board designed for high-performance precision instruments.
Product Overview
12-layer HDI resin plug hole PCB is a high-density interconnection printed circuit board designed for high-performance precision instruments. This 12-layer PCB is an ideal choice for precision instrument data transmission with its excellent electrical performance, fine line layout and stable reliability. It adopts advanced HDI technology and resin plug hole process to achieve fast line transmission and efficient heat dissipation, meeting the strict requirements of high-speed data transmission for performance and reliability.
Product Features
1. High-density interconnection technology: Using HDI technology to achieve higher circuit density and complexity, and improve data transmission speed.
2. Resin plug hole process: Improve the mechanical strength and electrical performance of PCB and ensure signal integrity.
3. Fine line layout: The minimum line width/line spacing is 0.035mm, which realizes high-density wiring and improves signal transmission speed.
4. Environmentally friendly solder mask ink: Black oil and white text environmentally friendly solder mask, providing clear visual contrast while protecting the circuit from the external environment.
5. Soft and hard combination design: Combining the advantages of rigid PCB and flexible PCB, providing the ability of three-dimensional wiring and lightweight design.
Technical Specifications
| Number of layers | 12 layers | Ink color | Black ink with white characters |
| Raw material | SY1000 | Minimum line width/line spacing Line width | 0.035mm |
| Thickness | 0.6mm | Solder mask | Yes, black ink with white characters |
| Copper thickness | 1 oz/35 microns | Surface treatment | Immersion Gold (Au), resin plugging |
Application
1. High-performance server and data center storage
2. Control and communication systems for industrial machinery
3. High-performance computing in aerospace and military fields
4. Data processing and transmission in medical equipment
5. Advanced driver assistance systems (ADAS) in automotive electronics
Special Production Process
Resin plugging process: Improve the mechanical strength and electrical performance of the PCB through resin plugging to ensure signal integrity.
High-density interconnect (HDI) process: Use thinner wires and smaller apertures to achieve higher circuit density.
Lamination technology: Use heat and pressure to bond the inner and outer layers of the PCB together to form a solid multi-layer PCB.
Fine line processing: Use high-precision equipment for line processing to ensure that the minimum line width/line spacing reaches 0.035mm, meeting the needs of high-density circuit design.
Product Summary
The 12-layer HDI resin plug hole PCB has become a leading choice in the field of high-performance precision instruments with its high-density interconnection technology, resin plug hole process, fine line layout and soft-hard combination design. This PCB not only meets the needs of high-speed data transmission for high performance and high reliability, but also provides excellent performance and reliability through special production processes. It is an ideal choice for precision instrument manufacturers and electronic engineers, helping your products stand out in the market.
