The 10-layer 3-level HDI Shengyi material immersion gold PCB is a complex operating system circuit board designed for high-performance instruments.
Product Overview
The 10-layer 3-level HDI Shengyi material immersion gold PCB is a complex operating system circuit board designed for high-performance instruments. It uses advanced 3-level HDI technology, combined with Shengyi materials and immersion gold surface treatment technology to meet the requirements of high-density interconnection and fine lines.
Product Features
1. High-density interconnection: Using 3-level HDI technology to achieve smaller line width and line spacing, and improve the line density of the circuit board.
2. Excellent electrical performance: immersion gold surface treatment provides better electrical signal transmission, reduces signal loss, and improves circuit performance.
3. Enhanced reliability: 10-layer structural design provides stronger mechanical support and circuit stability.
4. Fine line control: Through precise 3-level HDI process, the optimized design of fine lines and space is achieved.
5. Environmentally friendly materials: Using Shengyi materials, it meets environmental protection requirements and reduces the impact on the environment.
Technical Specifications
| Number of layers | 10 layers | Ink color | Green oil with white characters |
| Raw materials | Shengyi Materials SY1000-2 | Minimum line width/line spacing | According to the 3-level HDI process, smaller line width and line spacing can be achieved |
| Thickness | 1.6mm | Solder mask | Yes |
| Copper thickness | 1OZ inner layer, 1OZ outer layer | Surface treatment method | ENIG (Electroless Nickel Immersion Gold) |
Application Areas
High-performance calculators
Precision measuring equipment
Communication equipment
Medical instruments
Aerospace equipment
Special Production Process
1.3-level HDI process: high-density line interconnection is achieved through micro-blind/buried hole technology.
2. ENIG surface treatment: provides excellent welding performance and long-term stability.
Product Summary
10-layer 3-level HDI Shengyi Materials ENIG PCB has become an ideal choice for complex operating systems of high-performance instruments with its excellent electrical performance, high-density interconnection capabilities and reliability. Combined with advanced 3-level HDI process and ENIG surface treatment technology, this product can meet the most stringent circuit design requirements and provide strong support for high-end electronic products.
