The 10-layer HDI hard-soft data transmission PCB is a high-performance printed circuit board designed for high-speed data transmission.
Product Overview
The 10-layer HDI hard-soft data transmission PCB is a high-performance printed circuit board designed for high-speed data transmission. This 10-layer PCB is an ideal choice for data transmission in servers and industrial machinery with its excellent electrical performance, fine line layout and stable reliability. It adopts advanced HDI technology and hard-soft combination design to achieve fast line transmission and efficient heat dissipation, meeting the strict requirements of high-speed data transmission for performance and reliability.
Product Features
1. High-density interconnection technology: Adopts micro-blind buried hole technology and laser laser technology to achieve high-density line layout and improve data transmission speed.
2. Hard-soft combination design: Combining the advantages of rigid PCB and flexible PCB, it provides the ability of three-dimensional wiring and lightweight design.
3. Fine line layout: The minimum line width/line spacing is 0.035mm, which realizes high-density wiring and improves signal transmission speed.
4. Environmentally friendly solder mask ink: PSR-4000 AUS308 environmentally friendly solder mask provides clear visual contrast while protecting the circuit from external environmental influences.
5. Diverse surface treatment: immersion gold, BGA and OSP surface treatment, providing diverse welding and connection options, enhancing the reliability and durability of the circuit.
Technical Specifications
| Number of layers | 10 layers | Ink color | Green ink with white characters |
| Raw material | SY1000 | Minimum line width/line spacing Line width | 0.035mm |
| Thickness | 0.5mm | Solder mask | Yes, green ink with white characters |
| Copper thickness | 1 oz/35 microns | Surface treatment method | Immersion Gold (Au), BGA, OSP |
Application
1. High-speed data transmission in servers and data centers
2. Control and communication systems for industrial machinery
3. High-performance computing in aerospace and military fields
4. Data processing and transmission in medical equipment
5. Advanced driver assistance systems (ADAS) in automotive electronics
Special Production Process
Laser drilling process: The vias are laser drilled with an aperture accuracy of 0.06mm to ensure the stability and accuracy of the connection.
Micro-hole technology: Use micro-hole technology to achieve high-density interconnection and improve the integration and performance of the circuit board.
Lamination technology: Use heat and pressure to bond the inner and outer layers of the PCB together to form a solid multi-layer PCB.
Through-hole filling and flattening: Improve the reliability of the PCB, remove excess material, and ensure a flat surface.
Product Summary
The 10-layer HDI hard-soft data transmission dedicated PCB has become a leading choice in the field of data transmission with its high-density interconnection technology, hard-soft combination design, fine line layout and diversified surface treatment. This PCB not only meets the needs of high-performance and high reliability for high-speed data transmission, but also provides excellent performance and reliability through special production processes. It is an ideal choice for data transmission equipment manufacturers and electronic engineers, helping your products stand out in the market.
