HDI Electronic PCB for MEMS is a high-density interconnect printed circuit board designed for micro-electromechanical systems (such as sensors, microphones, etc.).
Product Overview
HDI Electronic PCB for MEMS is a high-density interconnect printed circuit board designed for micro-electromechanical systems (such as sensors, microphones, etc.). This 4-layer PCB is an ideal choice for electronic micro-electromechanical system applications with its excellent performance, fine line layout and stable reliability. It adopts advanced HDI technology to achieve fast transmission of lines and efficient heat dissipation, meeting the needs of electronic equipment for miniaturization and high performance.
Product Features
1. High-density interconnect technology: Adopt micro-blind buried hole technology to achieve high-density layout of lines and improve the performance and reliability of circuit boards.
2. Fine line layout: Support fine lines and micro-holes to achieve smaller apertures and finer line widths, improve signal transmission speed and circuit response speed.
3. Lightweight design: The ultra-thin thickness of 0.25mm provides extreme space utilization for micro-electromechanical systems, which is conducive to the light and thin design of products.
4. Environmentally friendly solder mask ink: PSR-4000 AUS308 environmentally friendly solder mask provides clear visual contrast while protecting the circuit from external environmental influences.
5. Excellent surface treatment: nickel-palladium-gold surface treatment, enhances welding performance and corrosion resistance, and extends product life.
Technical Specifications
| Number of layers | 4 layers | Ink color | Green oil with white characters |
| Raw materials | SI10US | Minimum line width/line spacing Line width | According to HDI technology, 75/75μm and below can be achieved, line spacing: same as above |
| Thickness | 0.25mm | Solder mask | Yes, PSR-4000 AUS308 |
| Copper thickness | 1 ounce/35 microns | Surface treatment method | Nickel-palladium-gold (Immersion Nickel Gold, Ni/Pd/Au) |
Application Areas
1. Micro-electromechanical system (MEMS) sensor packaging
2. Micro-electromechanical system (MEMS) microphone module packaging
3. Sensors in the automotive, medical and other fields and microphone packaging for smart phones and wearable devices.
Special Production Process
Acoustic hole process: The via adopts the acoustic hole process to improve the connection stability and electrical performance of the via.
Micro blind buried via technology: Use laser drilling micro vias, electroplating to fill vias and other technologies to achieve high-density interconnection.
Lamination technology: Use heat and pressure to bond the inner and outer layers together to form a solid multi-layer PCB.
Through-hole filling and flattening: Improve the reliability of the PCB, remove excess material, and ensure a flat surface.
Product Summary
HDI electronic MEMS dedicated PCB has become a leading choice in the field of MEMS with its high-density interconnection technology, fine circuit layout, thin and light design and excellent surface treatment. This PCB not only meets the needs of MEMS for high performance and miniaturization, but also provides excellent performance and reliability through special production processes. It is an ideal choice for electronic MEMS manufacturers and electronic engineers, helping your products stand out in the market.
FAQ
1.Q: How far is your factory from the nearest airport?
A: About 30 kilometers
2.Q: What is your minimum order quantity?
A: One piece is enough to place an order.
3.Q: What to do if solder mask overflow affects soldering quality?
A: Solder mask overflow refers to the situation where the solder mask covers the pads or vias that should be exposed, affecting the soldering quality. To address this issue, precise window settings for the solder mask should be made during the design phase and communication with the manufacturer should be confirmed to ensure their process capabilities prevent excessive overflow.
4.Q: What to do if PCB warps or deforms during manufacturing or soldering?
A: Warping and deformation of PCBs during manufacturing or soldering are due to thermal stress, which can affect assembly and functionality. Strategies to mitigate this include selecting appropriate base materials and controlling the uniformity of heating during the process. In some cases, adding stiffeners in the design can reduce the risk of warping.
