6-Layer communication PCB is designed for high-performance electronic products and Mobile phone, especially for applications with extremely high requirements for signal integrity and miniaturization.
Technical Specifications
| Number of layers | 8 | Minimum line width and line spacing | 0.075/0.075mm |
| Board thickness | 1.03mm | Minimum aperture | 0.1 |
| Board material | S1000-2M | Surface treatment | 2” immersion gold |
| Copper thickness | 0.5 inner layer, 1OZ outer layer | Process points | HDI first order + countersunk hole + BGA size 0.2mm |
| WHY US |
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| Fast Delivery | High Quality | Diversified Customization | ||
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| Photoengraving Workshop | Drilling Machine | Electroplating Production Line | ||
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| Strategic Partners | Application | Certificate |
FAQ
1.Q: How many employees do you have in your factory?
A: More than 500.
2.Q: Are the materials you use environmentally friendly?
A: The materials we use are in accordance with ROHS standard and IPC-4101 standard.
3.Q: What problems can be caused by inaccurate PCB design in mobile phones?
A: If the circuit design lacks a rational layout, it may lead to signal interference and unstable transmission, thereby affecting the performance of the entire phone. Therefore, we need to fully consider the position of each component and the rationality of the wiring during the PCB design phase.
4.Q: Can your company manufacture impedance boards and crimp hole circuit boards?
A: We can produce impedance PCB, and the same product can be made with multiple impedance values. We can also manufacture precision holes for crimp holes.
