4-Layer PCB for Small Optical Communication Instruments
The 4-layer PCB for small optical communication instruments is a high-performance printed circuit board designed specifically for small optical communication signal transmission systems. It features a 4-layer structure with advanced FR-4 substrate and gold plating surface treatment, ensuring excellent electrical performance and reliability.
The 4-layer PCB for small optical communication instruments is a high-performance printed circuit board designed specifically for small optical communication signal transmission systems. It features a 4-layer structure with advanced FR-4 substrate and gold plating surface treatment, ensuring excellent electrical performance and reliability. The product has high-density wiring and precision manufacturing processes, meeting the stringent requirements of small optical communication instruments for high precision and high reliability.
Product Features
High-density Wiring: The 4-layer structure design achieves smaller line width and line spacing (0.08mm/0.28mm), increasing wiring density to meet the needs of complex optical communication signal transmission systems.
Excellent Electrical Performance: Gold plating surface treatment provides good conductivity and oxidation resistance, ensuring stable and reliable signal transmission.
High Reliability: The FR-4 substrate has excellent mechanical strength and heat resistance, ensuring long-term stable operation in harsh environments.
Precise Solder Mask Process: Green solder mask with white text, not only aesthetically pleasing but also effectively protects the PCB surface, preventing short circuits and corrosion.
High-precision Vias: The minimum via diameter is 0.56mm, ensuring precise installation and good electrical connection for optical communication instruments.
Technical Specifications
Number of layers
4 layers
Minimum line width/line spacing
0.08mm/0.28mm
Raw material
FR-4
Minimum Via Diameter
0.56mm
Thickness
1.0mm
Surface treatment method
immersion gold
Copper thickness(Inner/Outer)
1OZ/1OZ
Ink color
green oil white text
Application Areas
Small Optical Communication Signal Transmission Systems: Suitable for signal transmission and processing in small optical communication devices, such as optical modules and transceivers.
Data Centers: Used in optical communication equipment in data centers, providing high-speed data transmission and processing capabilities.
Communication Base Stations: Suitable for optical communication equipment in communication base stations, ensuring stable signal transmission.
Industrial Automation: Used in optical communication modules of industrial automation equipment, improving the communication efficiency and reliability of the equipment.
Special Production Process
Gold Plating Process: Through electrochemical deposition, a uniform layer of gold is formed on the PCB surface, providing excellent conductivity and oxidation resistance.
High-precision Drilling Technology: Ensures the precision of the minimum via diameter of 0.56mm, meeting the precise installation and good electrical connection requirements of optical communication instruments.
Precise Solder Mask Process: Uses high-quality green solder mask and white text ink, ensuring the aesthetics and functionality of the solder mask layer.
Strict Quality Control: From raw material procurement to the production process, strict quality control is implemented to ensure the reliability and stability of the product.
Product Summary
The 4-layer PCB for small optical communication instruments, with its high-density wiring, excellent electrical performance, high reliability, and precise manufacturing processes, is the ideal choice for small optical communication signal transmission systems. It not only meets the stringent requirements of small optical communication instruments for high precision and high reliability but also ensures long-term stable operation in various environments, providing a solid foundation for the performance enhancement and reliability of optical communication equipment.
