The 10-Layer High-Frequency & High-Speed Communication PCB is engineered to address the rigorous demands of modern high-frequency communication systems, including 5G networks, satellite communications, and advanced radar technologies. Utilizing EM-892K substrate with ultra-low dielectric loss (Dk=3.8@10GHz, Df=0.002), this PCB ensures minimal signal distortion even in multi-GHz frequency ranges.
The 10-Layer High-Frequency & High-Speed Communication PCB is engineered to address the rigorous demands of modern high-frequency communication systems, including 5G networks, satellite communications, and advanced radar technologies. Utilizing EM-892K substrate with ultra-low dielectric loss (Dk=3.8@10GHz, Df=0.002), this PCB ensures minimal signal distortion even in multi-GHz frequency ranges. Its 10-layer stackup integrates optimized power and ground planes, reducing EMI by 30% compared to conventional designs. Designed for mission-critical applications, it supports data rates up to 112G PAM4, making it ideal for next-generation optical modules and high-speed switches.
Superior High-Frequency Performance
EM-892K substrate with low-loss characteristics (Df=0.002) ensures signal attenuation <0.15dB/cm at 28GHz.
Nickel-palladium-gold (ENEPIG) surface finish provides <1μΩ contact resistance, enhancing signal fidelity.
High-Density Interconnect Design
Supports 6/5mil (0.15/0.127mm) line width/spacing, enabling 50% higher component density than standard PCBs.
Laser-drilled microvias (0.127mm diameter) with ±10μm precision ensure layer-to-layer alignment accuracy.
Robust Thermal and Mechanical Stability
1.6mm board thickness with thermal vias (0.3mm diameter) reduces thermal resistance by 25%.
RoHS-compliant materials withstand operating temperatures from -40°C to 150°C.
Enhanced Signal Integrity
Controlled impedance routing (±5% tolerance) for differential pairs (100Ω).
Ground shielding layers isolate high-speed signals, minimizing crosstalk (<-40dB).
Environmentally Resilient
Corrosion-resistant surface treatment passes 96-hour salt spray testing (ASTM B117).
| Layers | 10 |
| Material | EM-892K |
| Thickness | 1.6mm |
| Inner/Outer Copper Thickness | 0.5oz/1oz |
| Solder & Silkscreen | Blue/White |
| Min. Line Width/Spacing | 6/5mil (0.15/0.127mm) |
| Surface | ENEPIG |
5G Infrastructure: Base station RF front-end modules and massive MIMO antenna arrays.
Satellite Communications: LEO/MEO satellite transceivers requiring low-latency signal processing.
Military Radar Systems: Phased-array radar modules with ultra-wideband (UWB) signal handling.
Data Center Switches: 400G/800G optical interconnects for spine-leaf architectures.
Automotive ADAS: High-speed camera and LiDAR signal processing units.
Multi-Layer Alignment Control Technology
Automated optical alignment systems achieve interlayer registration accuracy <25μm, critical for 10-layer impedance consistency.
Micro-Hole Drilling & Precision Electroplating
UV laser drilling (355nm wavelength) creates 0.127mm microvias with a depth-to-diameter ratio of 12:1. Pulse electroplating ensures uniform copper deposition (18-25μm) for reliable interconnects.
Environmentally Optimized Surface Treatment
ENEPIG process deposits 0.1μm nickel, 0.05μm palladium, and 0.03μm gold layers, offering superior solderability and oxidation resistance while complying with RoHS directives.
The 10-Layer High-Frequency & High-Speed Communication PCB sets a benchmark for high-performance communication hardware. With EM-892K substrate, precision laser-drilled microvias, and ENEPIG surface treatment, it delivers unparalleled signal integrity and reliability in 5G, satellite, and military systems. Its robust design supports extreme environments while meeting RoHS and IPC-6012 standards, making it the go-to solution for engineers pushing the boundaries of high-speed connectivity.
Sanxis Tech, is a trusted PCB manufacturer with over 20 years of experience. Our products, including double-sided, multi-layer, HDI, flex-rigid boards, and more, are widely used in high-tech fields like automotive, medical, and industrial control. Equipped with state-of-the-art machinery and advanced testing facilities, we ensure top-quality output. Our certifications from RoHS, UL, ISO9001, and other organizations further guarantee reliability. Choose Sanxis Tech for quality and innovation.
