The “14-layer Communication Receiving AC PCB” is a high-performance printed circuit board specifically designed for the terminal of signal receiving in communication systems.
The “14-layer Communication Receiving AC PCB” is a high-performance printed circuit board specifically designed for the terminal of signal receiving in communication systems. It features a 14-layer structure and advanced materials to meet the demands of complex signal processing and high-frequency transmission.
Product Features
High-density routing: The 14-layer structure significantly increases routing density, enabling complex circuit connections within a limited space.
Excellent signal integrity: The use of low dielectric loss base material DS7409HGB ensures stable high-frequency signal transmission with low latency.
High reliability: Immersion gold 1U surface treatment provides excellent solderability and oxidation resistance, extending product life.
Precision manufacturing: Line width/space of 0.05mm/0.05mm and a minimum via diameter of 15μm meet high-precision circuit design requirements.
Good thermal performance: The multi-layer design helps dissipate heat, ensuring stable operation of the device at high frequencies.
Technical Specifications
Number of layers
14 layers
Minimum line width/line spacing
0.05/0.05mm
Raw material
DS7409HGB
Ink color
green oil white text
Thickness
1.0mm
Surface treatment method
1u immersion gold
Copper thickness(Inner/Outer)
1OZ/1OZ
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Application Areas
Communication Base Stations: For signal receiving and processing modules to ensure efficient communication between base stations and terminal devices.
Satellite Communication Equipment: Suitable for satellite antennas and signal processing units to ensure reliable long-distance signal transmission.
Wireless Routers: Used in home and enterprise networks for receiving and forwarding wireless signals.
5G Equipment: Supports high-frequency signal transmission for 5G networks, meeting the demands of high-speed data communication.
Special Production Process
High-precision drilling technology: Achieves a minimum via diameter of 15μm, ensuring precise interlayer connections.
Fine-line etching process: Guarantees line width/space of 0.05mm/0.05mm, meeting high-density routing requirements.
Immersion gold surface treatment: Provides excellent solderability and oxidation resistance, suitable for high-frequency signal transmission.
Product Summary
The “14-layer Communication Receiving AC PCB” is an essential component in modern communication systems, offering high-density routing, excellent signal integrity, and high reliability. With advanced manufacturing processes and high-quality materials, it ensures high performance and long life, making it an ideal choice for various communication applications.
