Let's continue to learn about the next five steps of inner layer process:
1. Exposure: The dry film pattern is cured through ultraviolet light exposure.
2. Developing: Unexposed parts of the dry film are removed, leaving the cured circuit pattern.
3. Inner Layer Inspection: The circuit pattern is inspected to ensure it meets the design requirements.
4. Inner Layer Oxidation: The inner layer circuits are treated with chemical oxidation to increase their corrosion and wear resistance.
5. Panelization: The inner layer circuit boards are arranged according to the design requirements in preparation for lamination.
