Today, let’s learn about how to make the inner route structure in PCB.
In the PCB manufacturing process, the fabrication of inner layer circuits is a crucial step that determines the performance and reliability of the circuit board. Here are the main steps of the inner layer process:
1. Inner Layer Cutting: Large sheets of substrate material are cut to the required size for processing according to the design specifications.
2. Baking: The board are heated to remove moisture and volatile substances, ensuring the stability of subsequent processes.
3. Chemical Cleaning: The surface of the board is cleaned with chemical solvents to remove grease and impurities, preparing for the attachment of dry film.
4. Physical Masking: Physical masks are created to determine the precise positioning of the circuits.
5. Dry Film Lamination: A layer of photosensitive dry film is evenly applied to the surface of the board to form the required circuit pattern.
We will learn about the next five steps in the next new.
