Company News

Sanxis New Product: 6-layer 5G Communication System AC PCB (Part 24)

2025-02-17

Sanxis Tech's new 6-layer 5G communication PCB structure

Sanxis Tech officially launched a revolutionary product for 5G communications - 6-layer 5G communication system receiver terminal PCB. Through innovative material selection and precision process design, the product can meet the critical needs of 5G base stations, industrial automation communication modules and intelligent transportation systems for high-frequency signal transmission.

 

Core technology breakthrough: high-performance materials enable signal integrity

1. High-frequency substrate optimization

This product uses Rogers RO4000 series high frequency laminate and FR-4 hybrid laminated design:

l RO4000 series materials: permittivity tolerance ±0.05, loss factor down to 0.0037 (10GHz), significantly reducing phase distortion in high-speed signal transmission.

l FR-4 reinforced layer: Through the thermal expansion coefficient matching technology, to ensure the dimensional stability of multi-layer structure in the extreme environment of -55~125.

 

2. TAIYO Ink older mask process

Using TAIYO Ink PSR-4000 PF9L blue solder mask ink.

l Environmentally friendly halogen-free formula: in line with RoHS 2.0 standards, VOC emissions are reduced by 30%

l High resolution process: Support 0.08mm line width /0.13mm line distance precision wiring, solder resistance layer thickness tolerance ±5μm

l Gold resistance: Through 168-hour salt spray test, antioxidant life increased by 40%

 

Core data

 

 Data

 technical specifications

 Layer

 6 layers mixed structure

 Material

 RO4003C+FR-4 material

 Thickness

1.0mm±0.1mm

Copper Thickness

 1oz out layer/1oz inner layer

Minimum-via hole

 0.6mm

Surface Treatment

 OSP Technique

Transmission path optimization of high frequency signal in multilayer board

Application scenarios

- 5G base station AAU/RRU unit

- Vehicle intelligent gateway control module

- Industrial Internet of Things edge computing node

5G Transfer

Production process and quality control
Adopt Sanxis Tech high-end HDI manufacturing system:

- Laser Direct Imaging (LDI) technology: positioning accuracy ±5μm

- Pulse copper plating process: uniformity of copper layer > 92%

 

- Three-stage blind hole design: 20μm level inter layer alignment

Sanxis Tech's new 6-layer 5G communication PCB

 

That's all for this new product, if you are interested in this new product from Sanxis, go to our "Products" page to find out more. Or place an order with one of our sales staff via "Contacts" or other contact information, and our team can provide you with a customized solution.

 


Sanxis Tech---- has been focusing on PCB design and manufacturing for many years, and has passed ISO14000, ISO 14001, ISO 9001, IATF 16949 system certification.

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