4-layer Miniature IC Chip Mounting PCB

Product Overview

The "4-layer Miniature IC Chip Mounting PCB" is a high-performance printed circuit board specifically designed for the assembly of high-consumption miniature IC chips. It utilizes advanced manufacturing processes and high-quality materials to ensure stable and reliable electrical connections and signal transmission in high-density, high-precision electronic devices. This product is suitable for a variety of miniaturized, high-performance electronic products, meeting the dual demands of modern electronic devices for miniaturization and high performance.

 

Product Features

1. High-density routing capability
   The 4-layer structure design effectively increases routing density to meet complex circuit requirements.
2. Excellent electrical performance
   Gold plating surface treatment ensures low contact resistance and high conductivity, extending product life.
3. High reliability
   FR-4 substrate provides good insulation and thermal resistance, making it suitable for various working environments.
4. Precision craftsmanship
   Black solder mask with white lettering enhances the PCB's aesthetics and readability while protecting the circuits from contamination.
5. Environmental friendliness and durability
   Compliant with environmental standards, the 1oz copper thickness ensures stable and durable circuit performance.

 

Technical Specifications

Number of layers	4 layers	Minimum line width/line spacing	5mil/5mil
Raw material	FR-4	Ink color	black oil white text
Thickness	1.2mm	Surface treatment method	immersion gold
Copper thickness(Inner/Outer)	1OZ/1OZ	/	/

 

Application Areas

• Consumer Electronics
  Smartphones, tablets, smart wearable devices, etc.
• Communication Equipment
  5G base stations, routers, switches, etc.
• Medical Devices
  Portable medical diagnostic equipment, intelligent health monitoring devices, etc.
• Industrial Automation
  Small controllers, sensor modules, etc.
• IoT Devices
  Smart home control modules, intelligent security devices, etc.

 

Special Production Process

1. High-precision etching process
   Ensures routing precision with a minimum line width/spacing of 5mil/5mil to meet high-density routing requirements.
2. Gold plating surface treatment
   Provides excellent oxidation resistance and solderability, suitable for the assembly of high-precision miniature IC chips.
3. Black solder mask with white lettering
   Enhances the aesthetics and readability of the PCB while protecting the circuits from contamination and oxidation.
4. Multi-layer alignment process
   Ensures precise alignment of the 4-layer structure to guarantee stable and reliable signal transmission.

 

Product Summary

The "4-layer Miniature IC Chip Mounting PCB" is an ideal choice for the assembly of high-consumption miniature IC chips, thanks to its high-density routing capability, excellent electrical performance, and reliable structural design. It is suitable for a variety of high-performance, miniaturized electronic devices and meets the stringent requirements of modern electronics for miniaturization, high performance, and high reliability. Choose Sanxis Tech PCB products, we could promise your PCB good quality, and high-level.

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