Product Overview
The 8-layer High-Speed Server Signal Transmission PCB is specifically designed for high-speed signal transmission in servers. This product utilizes high-performance FR-4 substrate and a thickness of 3.0mm, ensuring the mechanical strength and stability of the PCB. The green solder mask with white lettering and gold plating surface treatments further enhance the reliability and corrosion resistance of the product, making it suitable for high-frequency, high-density signal transmission environments.
Product Features
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High-speed signal transmission: The 8-layer design ensures high-speed signal transmission and low latency, suitable for high-performance servers and data centers.
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High reliability: The FR-4 substrate and gold plating surface treatments ensure the stability and reliability of the PCB in various environments.
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Good electrical performance: 1oz copper thickness for both inner and outer layers ensures low resistance and high current carrying capacity, suitable for high-power and high-frequency signal transmission.
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Excellent mechanical strength: The 3.0mm thickness and green solder mask with white lettering enhance the mechanical strength and corrosion resistance of the board.
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Environmental sustainability: Uses environmentally friendly materials and processes, complying with international environmental standards.
Technical Specifications
| Number of layers |
8 layers |
Minimum line width/line spacing |
0.1mm/0.1mm |
| Raw material |
FR-4 |
Size |
161.80mm*157.05mm |
| Thickness |
3.0mm |
Surface treatment method |
immersion gold, thick gold plating |
| Copper thickness(Inner/Outer) |
1OZ/1OZ |
Ink color |
green oil white text |
Application Areas
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High-performance servers: Suitable for high-performance servers in data centers, ensuring high-speed signal transmission and low latency.
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Network communication equipment: Suitable for routers, switches, and other network communication equipment, providing high-density, high-speed signal transmission.
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Storage devices: Suitable for storage arrays and high-performance storage devices, ensuring fast data read/write and transmission.
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Industrial automation: Suitable for industrial automation control systems, providing high reliability and high stability in signal transmission.
Special Production Process
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Multi-layer lamination technology: Utilizes advanced multi-layer lamination technology to ensure high-density wiring and signal integrity in the 8-layer board.
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Gold plating and thick gold plating surface treatments: Provide low contact resistance and good solderability, protecting the PCB surface from oxidation and corrosion, ensuring soldering quality.
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Green solder mask with white lettering: Enhances the mechanical strength and corrosion resistance of the board, improving the product's reliability and aesthetics.
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High-precision etching process: Ensures a minimum line width/spacing of 0.1mm/0.1mm, meeting the demand for high-density wiring, increasing circuit integration.
Product Summary
The 8-layer High-Speed Server Signal Transmission PCB is a high-performance, high-reliability PCB board, specifically designed for high-speed signal transmission in servers. Its capabilities in high-speed signal transmission, high reliability, good electrical performance, and excellent mechanical strength make it widely applicable in the fields of high-performance servers, network communication equipment, storage devices, and industrial automation. Utilizing advanced multi-layer lamination technology and gold plating surface treatments, the product ensures high performance and reliability, making it an ideal choice for modern high-performance computing and communication equipment.
